i.MX RT1180: Crossover MCU with TSN Switch and EdgeLock®

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i.MX RT1180 Crossover MCU

i.MX RT1180 Crossover MCU

Features

Multicore Processing

  • Arm Cortex-M7 at 800 MHz and Arm Cortex-M33 up to 300 MHz
    • Optional: single core Arm Cortex-M33

Software and Tools

  • MCUXpresso developer experience
    • Selection of IDE choices
    • Pin, clock, peripheral, security and memory config tools
    • Security programming and provisioning tools
    • Software development kit (SDK)
  • Zephyr RTOS support

Networking

  • First real-time microcontroller (MCU) with an integrated Gbps time-sensitive network (TSN) switch supporting multiple protocols bridging communications between existing systems and Industry 4.0
    • Real-time industrial Ethernet protocols such as Profinet, Ethernet/IP, EtherCAT, CC-Link IE Field, HSR and more
    • Latest generation of TSN standards compliant to IEC 60802 for industrial automation
    • TSN based protocols such as OPC UA Pub-Sub, Profinet over TSN and CC-Link IE TSN
  • Up to 5 Gbps ports including 4x ports on the TSN switch (Layer 2) and 1x port on the TSN endpoint controller
  • L2 management with advanced flow control features including port counters, filters and more

Advanced Security

  • First crossover MCU with an integrated EdgeLock® Secure Enclave
    • Preconfigured, self-managed, autonomous security subsystem, easing complexity of implementing robust, system-wide security for networked, industrial IoT applications
  • Providing component level foundation for IEC 62443 system compliance
  • Root of trust requirements in complex networked systems with secure boot, secure key mechanism and high performance crypto
  • System-level physical tamper monitoring with secure RTC and 10 tamper pins

On-Chip Memory

  • Up to 1.5 MB SRAM (ECC protected) with 512 KB of TCM for Arm Cortex-M7 and 256 KB of TCM for Arm Cortex-M33

Analog

  • High-speed 16-bit analog to digital converters
  • Advanced timer/PWM and delta-sigma demodulators

Temperature and Qualifications

  • Robust extended industrial qualification (-40 °C to 125 °C)

Packaging

  • 289 MAPBGA, 14 x 14 mm, 0.8 mm pitch
  • 144 MAPBGA, 10 x10 mm, 0.8 mm pitch

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设计文件

硬件

快速参考恩智浦 板类型.

3 硬件

软件

快速参考恩智浦 软件类型.

3 软件文件

  • BSP及设备驱动

    i.MX Software and Development Tools

  • 中间件

    AVB/TSN Stack for i.MX RT1050, RT1170 and RT1180 crossover MCU

  • 调试及视觉化工具

    Config Tools for i.MX, Linux DEB package

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