The X-IN-1 modular platform provides the hardware and software needed to integrate multiple electrification systems. It enables automakers and Tier 1 suppliers to design scalable platforms combining a power inverter with PMSM motor control and LEM current sensing, and a DC-DC converter.
The hardware includes a control system with an S32K396 Mcu-based motherboard, a power inverter with gate driver board, a standalone Hall-effect LEM sensor board, and a 48 V to 12 V automotive DC-DC converter suitable for battery charging. And the FlexFoundation software, which ensures safe, efficient coordination of applications and includes pre-integrated demos.
The first two use cases supported—with dedicated hardware, software, and comprehensive documentation—are:
| Function | Description | Orderable Part Number |
|---|---|---|
| S32K39 X-IN-1 Control Motherboard | Motherboard for S32K39 | XIN1-MB-S32X |
| S32K39 MCU EVB KIT | S32K396-BGA-DC1 | |
| Inverter Application Actuation Board | High voltage gate driver board | RDGD3162I3PH5EVB |
| LEM sensor board | XIN1-FB-LEM* | |
| Cable between mother board and gate driver board — recommended 6 inch PCIe | XIN1-CABLE6* | |
| Cable between mother board and gate driver board — alternative 12 inch PCIe | XIN1-CABLE12* | |
| Power module: not provided — compatible with HybridPack | - | |
| Application Actuation Board | DC-DC board | XIN1-DC-DC-LV |
| Cable between mother board and DC-DC board: recommended 6 inch PCIe | XIN1-CABLE6* | |
| Application Actuation Board | BMS TPL gateway board | FRDM665SPEVB |
| BMS cell monitoring unit | RDBESS774A3EVB | |
| Battery junction box board | RDA777T2 |
S32K39/37/36 Electrification Microcontrollers Evaluation Board.
3 Phase Inverter Reference Design Using the GD3162 with HybridPACK Drive.
