RW610FML: High-Performance Wi-Fi 6 and Bluetooth® Low Energy (LE) Combo Module with Integrated MCU

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RW610FML

RW610FML Block Diagram

Features

Key Features

  • NXP RW610 inside
  • 260 MHz Arm™ Cortex™-M33
  • Supports IEEE 802.11a/b/g/n/ac/ax specification: dual‑band 2.4 GHz and 5 GHz Wi-Fi 6 SISO with 20 MHz channels; Up to MCS9 (114 Mbps) peak data rates
  • Supports Bluetooth LE features (2 Mbit/s high-speed mode, long range and advertising extensions)
  • 8 MB Flash on module and 1.2 MB embedded SRAM on-chip
  • Flexible Serial Peripheral Interface (FlexSPI) external flash interface supports eXecute-In-Place (XIP) and on-the-fly firmware encryption, decryption, and authentication
  • Normal operating temperature range: -40 °C to 85 °C
  • Storage temperature: -45 °C to +95 °C
  • Dimensions: (25.5 ±0.2)mm × (18 ±0.2)mm × (3.16 ±0.2)mm
  • Weight: approx. 1.51 g
  • MSL: 3
  • Surface-mount type

Supported Peripheral Interfaces

  • General Purpose Input Output (GPIO)
  • Secure digital input output (SDIO)
  • Universal asynchronous receiver-transmitter (UART)
  • Serial peripheral interface (SPI)
  • Pulse code modulation (PCM)
  • Inter-integrated circuit (I²C)
  • Inter-IC sound (I²S)
  • Pulse width modulation (PWM)
  • Analog-to-digital (ADC)
  • Digital-to-analog (DAC)
  • USB
  • Joint Test Action Group / serial wire debug (JTAG/SWD)
  • LCD
  • Digital microphone (DMIC)
  • Analog Comparator (ACOMP)
  • Mirco-tick timer (UTICK)
  • Universal subscriber identity module ((U)SIM)
  • Wireless coexistence interface 2nd version (WCI 2)
  • Packet traffic arbitration (PTA)

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