部分 | 封装 | 物质声明 | 安全保障/功能安全 | 湿度灵敏度等级(MSL) | Peak Package Body Temperature(PPT)(℃) | Maximum Time at Peak Temperature(s) | |||
---|---|---|---|---|---|---|---|---|---|
无铅焊接 | 无铅焊接 | 无铅焊接 | |||||||
S32K358GHT1MJBST 封装 : LFBGA289 |
S32K358GHT1MJBST (935461967557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K344EHT1MPBST 封装 : HDQFP172 |
S32K344EHT1MPBST (935434685557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K344EHT1MMMST 封装 : LFBGA257 |
S32K344EHT1MMMST (935438574557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K342EHT0MPBST 封装 : HDQFP172 |
S32K342EHT0MPBST (935436145557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K342EHT0MPAST 封装 : HDQFP100 |
S32K342EHT0MPAST (935442944557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K341EHT0MPBST 封装 : HDQFP172 |
S32K341EHT0MPBST (935437411557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K341EHT0MPAST 封装 : HDQFP100 |
S32K341EHT0MPAST (935442927557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K324EHT1MPBST 封装 : HDQFP172 |
S32K324EHT1MPBST (935437129557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K324EHT1MMMST 封装 : LFBGA257 |
S32K324EHT1MMMST (935438573557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K322EHT0MPBST 封装 : HDQFP172 |
S32K322EHT0MPBST (935437513557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K322EHT0MPAST 封装 : HDQFP100 |
S32K322EHT0MPAST (935442943557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K314EHT1MPBST 封装 : HDQFP172 |
S32K314EHT1MPBST (935438572557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K314EHT1MMMST 封装 : LFBGA257 |
S32K314EHT1MMMST (935432209557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K312NHT0MPBST 封装 : HDQFP172 |
S32K312NHT0MPBST (935436148557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K312NHT0MPAST 封装 : HDQFP100 |
S32K312NHT0MPAST (935438784557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K311NHT0MPAST 封装 : HDQFP100 |
S32K311NHT0MPAST (935442929557) |
ISO 26262 | 3 | 260 | 40 | ||||
S32K311NHT0MLFST 封装 : LQFP48 |
S32K311NHT0MLFST (935442928557) |
ISO 26262 | 3 | 260 | 40 |