部分 | 封装 | 物质声明 | 安全保障/功能安全 | 湿度灵敏度等级(MSL) | Peak Package Body Temperature(PPT)(℃) | Maximum Time at Peak Temperature(s) | |||
---|---|---|---|---|---|---|---|---|---|
铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | 铅焊接 | 无铅焊接 | ||||
SPC5566MZP80 封装 : BGA416 |
SPC5566MZP80 (935316969557) |
No | 3 | - | 260 | - | 40 | - | |
SPC5566MZP80R (935316969518) |
No | 3 | - | 260 | - | 40 | - | ||
SPC5566MZP144 封装 : BGA416 |
SPC5566MZP144 (935309958557) |
No | 3 | - | 260 | - | 40 | - | |
SPC5566MZP144R (935309958518) |
No | 3 | - | 260 | - | 40 | - | ||
SPC5566MZP132 封装 : BGA416 |
SPC5566MZP132 (935313983557) |
No | 3 | - | 260 | - | 40 | - | |
SPC5566MZP132R (935313983518) |
No | 3 | - | 260 | - | 40 | - | ||
SPC5566MVR144 封装 : BGA416 |
SPC5566MVR144 (935319453557) |
No | - | 3 | - | 260 | - | 40 | |
SPC5566MVR132 封装 : BGA416 |
SPC5566MVR132 (935319429557) |
No | - | 3 | - | 260 | - | 40 | |
SPC5566MVR132R (935319429518) |
No | - | 3 | - | 260 | - | 40 | ||
MPC5566MZP144 封装 : BGA416 |
MPC5566MZP144 (935325464557) |
No | 3 | - | 260 | - | 40 | - | |
MPC5566MZP132 封装 : BGA416 |
MPC5566MZP132 (935325435557) |
No | 3 | - | 260 | - | 40 | - | |
MPC5566MVR132 封装 : BGA416 |
MPC5566MVR132 (935324223557) |
No | - | 3 | - | 260 | - | 40 |