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MPC755和MPC745主机处理器

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参考手册 (4)

Errata to MPC750 RISC Microprocessor Family User’s Manual, Rev. 1[MPC750UMAD]

Programming Environments Manual for 32-Bit Implementations of the Power Architecture[MPCFPE32B]

The Bus Interface for 32-Bit Microprocessors that Implement the PowerPC Architecture[MPC60XBUSRM]

MPC750 RISC Microprocessor Family User Manual supporting MPC755, MPC750, MPC745, and MPC740[MPC750UM]

可靠性与质量信息 (3)

Component Level Failure Rate Calculation[FRCALC]

Board Level Failure Prediction Calculation Report[FPCREPORT]

MPC745/755 Qualification Report[MPC745755QI]

封装信息 (4)

Flip Chip Plastic Ball Grid Array (FC-PBGA) Presentation[FC-PBGAPRES]

PBGA Packaging Customer Tutorial[PBGAPRES]

TBGA Packaging Customer Tutorial[TBGAPRESPKG]

CBGA Packing Customer Tutorial[CBGAPRES]

应用笔记 (12)

AN13656: Assembly guidelines for Flip Chip plastic ball grid array and chip scale package Application Note[AN13656]

恩智浦微控制器故障排除清单[AN13461]

Synchronizing Instructions for PowerPC(TM) Instruction Set Architecture[AN2540]

Porting Linux to the Power Architeecture MPC7451[AN2145]

Design Checklist for Freescale Semiconductor PowerPC(TM) Microprocessors[AN2077]

TLB Translation Setup for MPC603e and MPC755 Microprocessors[AN2795]

Power Supply Design for Power Architecture(TM) Processors[AN2747]

Minimal Boot Sequence for Executing Compiled C Programs on PowerPC(TM) Devices[AN1809]

Simplified Mnemonics for PowerPC Instructions[AN2491]

Building an NFS DHCP/BOOTP Server for Use with Sandpoint and MVP Linux[AN2273]

Backside L2 Timing Analysis for PCB Design Engineers[AN1794]

Common Footprint for the MPC750, MPC755, MPC7400, and MPC7410 Application Note[AN1812]

应用笔记软件 (1)

Specifying Power Consumption[AN2436]

支持信息 (1)

Freescale Semiconductor Host Processor Version Register Settings[PPCPVR]

数据手册 (4)

MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC755BxxnnnTx Series[MPC755ECSO1AD]

MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC755xxxnnnLE Series[MPC755ECSO3AD]

MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC7n5BxxnnnLD Series[MPC755ECSO2AD]

MPC755 RISC Microprocessor Hardware Specifications[MPC755EC]

用户指南 (1)

Spectre and Meltdown Updates for Power ISA Cores[SPECTRE-MELTDOWN-POWER-ISA-DOC]

白皮书 (1)

Speculative Execution Vulnerabilities and Mitigations on NXP PowerPC Processors White Paper[SPECTREPPCWP]

设计资源

设计文件

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755, Dual Gate Oxide, 360 BGA Package, 3.3v I/O, 3.3v L2 IBIS Model

MPC755 BSDL for Rev. 1 of Silicon

755, Dual Gate Oxide, 360 BGA Package, 1.8v I/O, 1.8v L2 IBIS Model

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