包装信息 (2)
封装信息 (3)
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Wire bond die; 56 bonding pads[OL-PCF8576CU]
应用笔记 (5)
支持信息 (2)
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Footprint for wave soldering[HTQFP-HLQFP-LQFP-MSQFP-WAVE]
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Footprint for wave soldering[SSOP-TSSOP-VSO-WAVE]

