i.MX 937 Applications Processor: Secure, Smart, Power‑ and Cost‑Efficient, Scalable Edge AI Processing

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i.MX 937 Applications Processor

i.MX-937 Block Diagram

Features

Multicore Processing

  • 4x Arm® Cortex®‑A55 cores
  • NXP eIQ® Neutron NPU

Memory

  • Up to #### megatransfers per second (MT/s) x32/x16 low-power double data rate (LPDDR)5 or up to #### MT/s x32/x16
  • LPDDR4X with inline error correction code (ECC) and encryption
  • 3x ultra-secure digital host controller (uSDHC): secure digital (SD) 3.0; secure digital input/output (SDIO) 3.0, embedded MultiMediaCard (eMMC)5.1
  • Extended serial peripheral interface (XSPI) with integrated physical layer encryption and decryption (IPED), with support for serial peripheral interface (SPI) NOR and SPI NAND memories

Connectivity

  • 2x 1 GB/s Ethernet with time-sensitive networking (TSN), audio-video bridging (AVB) and IEEE 1588 for synchronization, plus energy-efficient Ethernet (EEE)
  • 1x PCI Express (PCIe) Gen 3.0 (1‑lane) and 2x USB 2.0 with integrated PHY
  • 2x 32‑pin FlexIO interfaces (bus or serial I/O)
  • 8x universal asynchronous receiver/transmitter(UART), 8x low-power serial peripheral interface (LPSPI), 8x low-power inter‑integrated circuit (LPI2C) and 3x controller area network flexible data rate (CAN‑FD)

Packaging

  • 19 x 19 mm, flip‑chip ball grid array (FCBGA), 0.7 mm pitch, and 15 x 15 mm, FCBGA, 0.5 mm pitch

Temperature Range

  • Automotive: ‑40 °C Ta to 125 °C Tj
  • Extended industrial: ‑40 °C Ta to 125 °C Tj
  • Industrial: ‑40 °C Ta to 105 °C Tj
  • Commercial: 0 °C Ta to 90 °C Tj

Security

  • EdgeLock® Secure Enclave (Advanced Profile), EdgeLock Prime Accelerator and post‑quantum cryptography (PQC)

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