400-2400 MHz，17.5 dB，33 dBm InGaP HBT GPA

MMG3006NT1
使用寿命终止

滚动图片以放大

MMG3006NT1是一款通用放大器，其内部输入进行了预匹配，专为广泛的A类、小信号、高线性度和通用应用而设计。 它适用于频率范围在400-2400 MHz之间的应用，例如：移动通信，PCS，WLL，PHS，VHF，UHF，UMTS和通用小信号射频。

产品详情

特征

  • 频率：400-2400 MHz
  • P1dB：33 dBm @ 900 MHz
  • 小信号增益：17.5 dB @ 900 MHz
  • 输出三阶交调点：49 dBm @ 900 MHz
  • 5 V单电源
  • 内部输入预匹配至50 Ohms
  • 符合RoHS规范
  • 采用盘卷包装。T1后缀 = 1000个，12 mm卷带宽度，13英寸卷盘。

购买/参数

‌
‌
‌
‌
‌
‌
‌
‌
‌
‌
‌
‌
‌
‌
‌
‌
‌

‌
‌
‌
‌
‌
‌
‌
‌

‌
‌
‌
‌
‌
‌
‌
‌

‌
‌
‌
‌
‌
‌
‌
‌

‌
‌
‌
‌
‌
‌
‌
‌

‌
‌
‌
‌
‌
‌
‌
‌

‌
‌
‌
‌
‌
‌
‌
‌

‌
‌
‌
‌
‌
‌
‌
‌

‌
‌
‌
‌
‌
‌
‌
‌

‌
‌
‌
‌
‌
‌
‌
‌

‌
‌
‌
‌
‌
‌
N true 0 PSPMMG3006NT1zh 8 封装信息 Package Information t790 1 应用笔记 Application Note t789 3 快速参考指南 Quick Reference Guide t525 1 手册 Brochure t518 1 数据手册 Data Sheet t520 1 简介 Fact Sheet t523 1 zh zh zh 数据手册 Data Sheet 1 1 6 English MMG3006N 400-2400 MHz, 33 dBm P1dB GPA designed for a broad range of Class A, small-signal, high linearity, general purpose applications 1201306329112729060252 PSP 484.5 KB None None documents None 1201306329112729060252 /docs/en/data-sheet/MMG3006NT1.pdf 484450 /docs/en/data-sheet/MMG3006NT1.pdf MMG3006NT1 documents N 2018-01-29 MMG3006NT1 400-2400 MHz, 33 dBm P1dB GPA Data Sheet /docs/en/data-sheet/MMG3006NT1.pdf /docs/en/data-sheet/MMG3006NT1.pdf Data Sheet N 980000996212993340 2022-12-07 pdf en Dec 29, 2017 980000996212993340 Data Sheet N MMG3006NT1 400-2400 MHz, 33 dBm P1dB GPA Data Sheet 应用笔记 Application Note 3 2 2 English This document explains the methodology used by NXP for thermal characterization of RF high power amplifier products, which include LDMOS and GaN active devices. 1075398872032723970051 PSP 235.5 KB None None documents None 1075398872032723970051 /docs/en/application-note/AN1955.pdf 235468 /docs/en/application-note/AN1955.pdf AN1955 documents N N 2016-11-09 Thermal Characterization Methodology of RF Power Amplifiers - Application Note /docs/en/application-note/AN1955.pdf /docs/en/application-note/AN1955.pdf Application Note N 645036621402383989 2025-01-28 pdf N en Jul 11, 2024 645036621402383989 Application Note Y N Thermal Characterization Methodology of RF Power Amplifiers - Application Note 3 3 English NXP Semiconductor's GaAs MMICs and General Purpose Amplifier (GPA) devices are all designed to operate from a single positive voltage supply. The GPAs have output powers ranging from 15 to 33 dBm. 1110219639469699797048 PSP 164.3 KB None None documents None 1110219639469699797048 /docs/en/application-note/AN3100.pdf 164299 /docs/en/application-note/AN3100.pdf AN3100 documents N 2005-03-07 General Purpose Amplifier and MMIC Biasing /docs/en/application-note/AN3100.pdf /docs/en/application-note/AN3100.pdf Application Note N 645036621402383989 2022-12-07 pdf en Mar 30, 2011 645036621402383989 Application Note Y N General Purpose Amplifier and MMIC Biasing 4 0 English This document provides guidelines for printed circuit board (PCB) designs for Power Quad Flat No-Lead (PQFN/QFN) packages soldered on thermal via. 1269548137868691501114 PSP 632.0 KB None None documents None 1269548137868691501114 /docs/en/application-note/AN3778.pdf 632021 /docs/en/application-note/AN3778.pdf AN3778 documents N N 2016-10-31 PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778 /docs/en/application-note/AN3778.pdf /docs/en/application-note/AN3778.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Feb 26, 2010 645036621402383989 Application Note Y N PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778 手册 Brochure 1 5 1 English Provides information about Our MMIC and GPA portfolio, applications, advantages and Smart Demo Reference Designs. 1298671914459724290742 PSP 416.3 KB None None documents None 1298671914459724290742 /docs/en/brochure/BR1609.pdf 416301 /docs/en/brochure/BR1609.pdf BR1609 documents N N 2016-10-31 RF GaAs Solutions /docs/en/brochure/BR1609.pdf /docs/en/brochure/BR1609.pdf Brochure N 712453003803778552 2024-08-26 pdf N en Dec 21, 2011 712453003803778552 Brochure Y N RF GaAs Solutions 简介 Fact Sheet 1 6 2 English Our GPAs combine the right level of gain, linearity, noise and power consumption specifications to meet the industry's most demanding applications 1327602291442691675874 PSP 199.7 KB None None documents None 1327602291442691675874 /docs/en/fact-sheet/RFGPAFS.pdf 199688 /docs/en/fact-sheet/RFGPAFS.pdf RFGPAFS documents N N 2016-10-31 General Purpose Amplifiers Fact Sheet /docs/en/fact-sheet/RFGPAFS.pdf /docs/en/fact-sheet/RFGPAFS.pdf Fact Sheet N 736675474163315314 2024-08-21 pdf N en Dec 30, 2014 736675474163315314 Fact Sheet Y N General Purpose Amplifiers Fact Sheet 封装信息 Package Information 1 7 C English 16 Terminal Thermally Enhanced Quad Flat Non-Leaded (QFN) 1158780013313725504286 PSP 58.1 KB None None documents None 1158780013313725504286 /docs/en/package-information/98ASA10761D.pdf 58145 /docs/en/package-information/98ASA10761D.pdf SOT1592-1 documents N N 2016-10-31 98ASA10761D, QFN-EP Punch, 4.0x4.0x0.85, Pitch 0.65, 16 Pins /docs/en/package-information/98ASA10761D.pdf /docs/en/package-information/98ASA10761D.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Mar 21, 2016 302435339416912908 Package Information D N 98ASA10761D, QFN-EP Punch, 4.0x4.0x0.85, Pitch 0.65, 16 Pins 快速参考指南 Quick Reference Guide 1 8 2 English NXP MMIC and GPA product cross reference to aid your device selection. 1298673156346699860206 PSP 1.0 MB None None documents None 1298673156346699860206 /docs/en/quick-reference-guide/MMICGPAQRG.pdf 1018484 /docs/en/quick-reference-guide/MMICGPAQRG.pdf MMICGPAQRG documents N N 2016-10-31 RF MMIC and GPA Cross Reference /docs/en/quick-reference-guide/MMICGPAQRG.pdf /docs/en/quick-reference-guide/MMICGPAQRG.pdf Quick Reference Guide N 803735842453594974 2024-08-26 pdf N en Dec 21, 2011 803735842453594974 Quick Reference Guide Y N RF MMIC and GPA Cross Reference false 0 MMG3006NT1 downloads zh-Hans true 1 Y PSP 封装信息 1 /docs/en/package-information/98ASA10761D.pdf 2016-10-31 1158780013313725504286 PSP 7 Mar 21, 2016 Package Information 16 Terminal Thermally Enhanced Quad Flat Non-Leaded (QFN) None /docs/en/package-information/98ASA10761D.pdf English documents 58145 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASA10761D.pdf 98ASA10761D, QFN-EP Punch, 4.0x4.0x0.85, Pitch 0.65, 16 Pins /docs/en/package-information/98ASA10761D.pdf documents 302435339416912908 Package Information N en None D pdf C N N 98ASA10761D, QFN-EP Punch, 4.0x4.0x0.85, Pitch 0.65, 16 Pins 58.1 KB SOT1592-1 N 1158780013313725504286 应用笔记 3 /docs/en/application-note/AN1955.pdf 2016-11-09 1075398872032723970051 PSP 2 Jul 11, 2024 Application Note This document explains the methodology used by NXP for thermal characterization of RF high power amplifier products, which include LDMOS and GaN active devices. None /docs/en/application-note/AN1955.pdf English documents 235468 None 645036621402383989 2025-01-28 N /docs/en/application-note/AN1955.pdf Thermal Characterization Methodology of RF Power Amplifiers - Application Note /docs/en/application-note/AN1955.pdf documents 645036621402383989 Application Note N en None Y pdf 2 N N Thermal Characterization Methodology of RF Power Amplifiers - Application Note 235.5 KB AN1955 N 1075398872032723970051 /docs/en/application-note/AN3100.pdf 2005-03-07 1110219639469699797048 PSP 3 Mar 30, 2011 Application Note NXP Semiconductor's GaAs MMICs and General Purpose Amplifier (GPA) devices are all designed to operate from a single positive voltage supply. The GPAs have output powers ranging from 15 to 33 dBm. None /docs/en/application-note/AN3100.pdf English documents 164299 None 645036621402383989 2022-12-07 /docs/en/application-note/AN3100.pdf General Purpose Amplifier and MMIC Biasing /docs/en/application-note/AN3100.pdf documents 645036621402383989 Application Note N en None Y pdf 3 N General Purpose Amplifier and MMIC Biasing 164.3 KB AN3100 N 1110219639469699797048 /docs/en/application-note/AN3778.pdf 2016-10-31 1269548137868691501114 PSP 4 Feb 26, 2010 Application Note This document provides guidelines for printed circuit board (PCB) designs for Power Quad Flat No-Lead (PQFN/QFN) packages soldered on thermal via. None /docs/en/application-note/AN3778.pdf English documents 632021 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN3778.pdf PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778 /docs/en/application-note/AN3778.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778 632.0 KB AN3778 N 1269548137868691501114 快速参考指南 1 /docs/en/quick-reference-guide/MMICGPAQRG.pdf 2016-10-31 1298673156346699860206 PSP 8 Dec 21, 2011 Quick Reference Guide NXP MMIC and GPA product cross reference to aid your device selection. None /docs/en/quick-reference-guide/MMICGPAQRG.pdf English documents 1018484 None 803735842453594974 2024-08-26 N /docs/en/quick-reference-guide/MMICGPAQRG.pdf RF MMIC and GPA Cross Reference /docs/en/quick-reference-guide/MMICGPAQRG.pdf documents 803735842453594974 Quick Reference Guide N en None Y pdf 2 N N RF MMIC and GPA Cross Reference 1.0 MB MMICGPAQRG N 1298673156346699860206 手册 1 /docs/en/brochure/BR1609.pdf 2016-10-31 1298671914459724290742 PSP 5 Dec 21, 2011 Brochure Provides information about Our MMIC and GPA portfolio, applications, advantages and Smart Demo Reference Designs. None /docs/en/brochure/BR1609.pdf English documents 416301 None 712453003803778552 2024-08-26 N /docs/en/brochure/BR1609.pdf RF GaAs Solutions /docs/en/brochure/BR1609.pdf documents 712453003803778552 Brochure N en None Y pdf 1 N N RF GaAs Solutions 416.3 KB BR1609 N 1298671914459724290742 数据手册 1 /docs/en/data-sheet/MMG3006NT1.pdf 2018-01-29 1201306329112729060252 PSP 1 Dec 29, 2017 Data Sheet MMG3006N 400-2400 MHz, 33 dBm P1dB GPA designed for a broad range of Class A, small-signal, high linearity, general purpose applications None /docs/en/data-sheet/MMG3006NT1.pdf English documents 484450 None 980000996212993340 2022-12-07 /docs/en/data-sheet/MMG3006NT1.pdf MMG3006NT1 400-2400 MHz, 33 dBm P1dB GPA Data Sheet /docs/en/data-sheet/MMG3006NT1.pdf documents 980000996212993340 Data Sheet N en None pdf 6 N MMG3006NT1 400-2400 MHz, 33 dBm P1dB GPA Data Sheet 484.5 KB MMG3006NT1 N 1201306329112729060252 简介 1 /docs/en/fact-sheet/RFGPAFS.pdf 2016-10-31 1327602291442691675874 PSP 6 Dec 30, 2014 Fact Sheet Our GPAs combine the right level of gain, linearity, noise and power consumption specifications to meet the industry's most demanding applications None /docs/en/fact-sheet/RFGPAFS.pdf English documents 199688 None 736675474163315314 2024-08-21 N /docs/en/fact-sheet/RFGPAFS.pdf General Purpose Amplifiers Fact Sheet /docs/en/fact-sheet/RFGPAFS.pdf documents 736675474163315314 Fact Sheet N en None Y pdf 2 N N General Purpose Amplifiers Fact Sheet 199.7 KB RFGPAFS N 1327602291442691675874 true Y Products

文档

快速参考恩智浦 文档类别.

筛选条件

8 文件

紧凑列表

封装信息 (1)
应用笔记 (3)
快速参考指南 (1)
手册 (1)
数据手册 (1)
简介 (1)

设计文件

快速参考恩智浦 设计文件类型.
筛选条件

2 设计文件

支持

您需要什么帮助?

  • Narrow your search
搜索