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X-in-1 Electrification: Overcoming Safety and Integration Challenges with NXP

X-in-1 Electrification: Overcoming Safety and Integration Challenges with NXP

About This Training

X-in-1 system integration (one box, one board, one chip) is rapidly shaping the future of vehicle electrification, with OEMs and Tier 1 suppliers driving strong adoption. Yet increased integration brings challenges, particularly in software isolation, functional safety, and scalability.

In this training, Vincent Lagardelle will explore key market trends and show how NXP’s X-in-1 modular platform solution enables safer, faster, and scalable electric vehicle designs.ivers in enabling high-performance, efficient and reliable solutions for inverters.

Presentation

What You Will Learn

X-in-1 Integration: how consolidating ECU functions can reduce cost, weight, and complexity
S32 “One Chip” MCU: enabling hardware-enforced isolation and freedom from interference (FFI)
FlexFoundation Suite: tools combining hardware, software orchestration, and GUI-based tools to simplify integration and safety
Scalable Modular Platform: flexibility to adapt designs across vehicle architectures and development needs
FuSa and Documentation Support: resources to streamline safety certification

Presented by

Vincent Lagardelle
Electrification System Marketing Manager, NXP Semiconductors

展开收起

时长

40 min

语言

英语

技术级别

初级

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Additional Resources

X-in-1 System Integration for Electric Vehicles (EVs)

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