A5M36SG239T2

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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of A5M36SG239T2Last Revision (GMT):
Thursday, 20 November 2025, 12:34:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A5M36SG239T2SOT2138HLFLGA35117.496200 mg YesNoYesOtherOthere4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 561 425282025-12-12GNot ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Capacitor 1Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0001800.1000000.000153
Nickel and its compoundsNickel, metal7440-02-00.17982099.9000000.153043
Subtotal0.180000100.00000000.153196
Capacitor 2Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001800.1000000.000153
Nickel and its compoundsNickel, metal7440-02-00.17982099.9000000.153043
Subtotal0.180000100.00000000.153196
Capacitor 3Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0003300.1000000.000281
Nickel and its compoundsNickel, metal7440-02-00.32967099.9000000.280579
Subtotal0.330000100.00000000.280860
Capacitor 4Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0019800.1000000.001685
Nickel and its compoundsNickel, metal7440-02-01.97802099.9000001.683476
Subtotal1.980000100.00000001.685161
Capacitor 5Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000900.1000000.000077
Nickel and its compoundsNickel, metal7440-02-00.08991099.9000000.076522
Subtotal0.090000100.00000000.076598
Capacitor 6Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0006600.1000000.000562
Nickel and its compoundsNickel, metal7440-02-00.65934099.9000000.561159
Subtotal0.660000100.00000000.561720
Capacitor 7Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0006600.1000000.000562
Nickel and its compoundsNickel, metal7440-02-00.65934099.9000000.561159
Subtotal0.660000100.00000000.561720
Capacitor 8Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0003300.1000000.000281
Nickel and its compoundsNickel, metal7440-02-00.32967099.9000000.280579
Subtotal0.330000100.00000000.280860
Capacitor 9Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0050000.1000000.004255
Nickel and its compoundsNickel, metal7440-02-04.99500099.9000004.251201
Subtotal5.000000100.00000004.255457
Capacitor 10Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0003300.1000000.000281
Nickel and its compoundsNickel, metal7440-02-00.32967099.9000000.280579
Subtotal0.330000100.00000000.280860
Capacitor 11Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0002700.1000000.000230
Nickel and its compoundsNickel, metal7440-02-00.26973099.9000000.229565
Subtotal0.270000100.00000000.229795
Capacitor 12Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0011400.1000000.000970
Nickel and its compoundsNickel, metal7440-02-01.13886099.9000000.969274
Subtotal1.140000100.00000000.970244
Inductor 1Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000080.0100000.000007
Nickel and its compoundsNickel, metal7440-02-00.07999299.9900000.068081
Subtotal0.080000100.00000000.068087
Inductor 2Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000850.1000000.000072
Nickel and its compoundsNickel, metal7440-02-00.08491599.9000000.072270
Subtotal0.085000100.00000000.072343
Inductor 3Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000170.0100000.000015
Nickel and its compoundsNickel, metal7440-02-00.17498399.9900000.148926
Subtotal0.175000100.00000000.148941
Inductor 4Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0004400.1000000.000374
Nickel and its compoundsNickel, metal7440-02-00.43956099.9000000.374106
Subtotal0.440000100.00000000.374480
Inductor 5Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0004400.1000000.000374
Nickel and its compoundsNickel, metal7440-02-00.43956099.9000000.374106
Subtotal0.440000100.00000000.374480
Inductor 6Copper PlatingCopper and its compoundsCopper, metal7440-50-80.04611599.9000000.039248
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000460.1000000.000039
Subtotal0.046161100.00000000.039288
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000340.1000000.000029
Nickel and its compoundsNickel, metal7440-02-00.03380599.9000000.028771
Subtotal0.033839100.00000000.028800
Resistor 1Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000500.0100000.000043
Nickel and its compoundsNickel, metal7440-02-00.50075099.9900000.426184
Subtotal0.500800100.00000000.426227
Resistor 2Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000580.0100000.000049
Nickel and its compoundsNickel, metal7440-02-00.57994299.9900000.493584
Subtotal0.580000100.00000000.493633
Resistor 3Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000290.0100000.000025
Nickel and its compoundsNickel, metal7440-02-00.28997199.9900000.246792
Subtotal0.290000100.00000000.246816
Resistor 4Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000290.0100000.000025
Nickel and its compoundsNickel, metal7440-02-00.28997199.9900000.246792
Subtotal0.290000100.00000000.246816
Resistor 5Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000250.0100000.000021
Nickel and its compoundsNickel, metal7440-02-00.25037599.9900000.213092
Subtotal0.250400100.00000000.213113
Resistor 6Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000070.0100000.000006
Nickel and its compoundsNickel, metal7440-02-00.06999399.9900000.059570
Subtotal0.070000100.00000000.059576
Resistor 7Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000150.0100000.000012
Nickel and its compoundsNickel, metal7440-02-00.14498599.9900000.123396
Subtotal0.145000100.00000000.123408
Resistor 8Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000150.0100000.000013
Nickel and its compoundsNickel, metal7440-02-00.14998599.9900000.127651
Subtotal0.150000100.00000000.127664
Resistor 9Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000450.0100000.000038
Nickel and its compoundsNickel, metal7440-02-00.44995599.9900000.382953
Subtotal0.450000100.00000000.382991
Semiconductor Die 1Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0027600.1000000.002349
Nickel and its compoundsNickel, metal7440-02-02.75724099.9000002.346663
Subtotal2.760000100.00000002.349012
Semiconductor Die 2Die SubstrateInorganic Silicon compoundsSilicon7440-21-30.53900098.0000000.458738
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0110002.0000000.009362
Subtotal0.550000100.00000000.468100
Semiconductor Die 3Die SubstrateInorganic Silicon compoundsSilicon7440-21-30.53900098.0000000.458738
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0110002.0000000.009362
Subtotal0.550000100.00000000.468100
Substrate, Pre-plated AuCopper PlatingCopper and its compoundsCopper, metal7440-50-893.21125099.90000079.331289
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0933050.1000000.079411
Subtotal93.304555100.000000079.410700
Gold PlatingGold and its compoundsGold, metal7440-57-50.53713799.9000000.457152
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0005380.1000000.000458
Subtotal0.537674100.00000000.457610
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0046180.1000000.003930
Barium and its compoundsBarium sulfate7727-43-70.90046519.5000000.766378
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4571599.9000000.389084
Magnesium and its compoundsTalc14807-96-60.1339152.9000000.113974
Organic compoundsOther organic compounds.0.2493605.4000000.212228
Phosphorus compoundsDiphenyl(2,4,6-trimethylbenzoyl)phosphine oxide75980-60-80.0369420.8000000.031441
PolymersPlastic: EP - Epoxide, Epoxy0.57260412.4000000.487338
PolymersPlastic: PAK2.26270849.0000001.925771
Subtotal4.617771100.00000003.930145
Total117.496200100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A5M36SG239T2
Product content declaration of A5M36SG239T2
上次修订 Last Revision (GMT):
Thursday, 20 November 2025, 12:34:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)邻苯二甲酸二正丁酯(DBP)邻苯二甲酸二异丁酯(DIBP)邻苯二甲酸丁基苄酯(BBP)邻苯二甲酸二(2-乙基)己酯(DEHP)
电容器
Capacitor 1
镀镍层
Nickel Plating
OOOOOOOOOO
电容器
Capacitor 2
镀镍层
Nickel Plating
OOOOOOOOOO
电容器
Capacitor 3
镀镍层
Nickel Plating
OOOOOOOOOO
电容器
Capacitor 4
镀镍层
Nickel Plating
OOOOOOOOOO
电容器
Capacitor 5
镀镍层
Nickel Plating
OOOOOOOOOO
电容器
Capacitor 6
镀镍层
Nickel Plating
OOOOOOOOOO
电容器
Capacitor 7
镀镍层
Nickel Plating
OOOOOOOOOO
电容器
Capacitor 8
镀镍层
Nickel Plating
OOOOOOOOOO
电容器
Capacitor 9
镀镍层
Nickel Plating
OOOOOOOOOO
电容器
Capacitor 10
镀镍层
Nickel Plating
OOOOOOOOOO
电容器
Capacitor 11
镀镍层
Nickel Plating
OOOOOOOOOO
电容器
Capacitor 12
镀镍层
Nickel Plating
OOOOOOOOOO
电感
Inductor 1
镀镍层
Nickel Plating
OOOOOOOOOO
电感
Inductor 2
镀镍层
Nickel Plating
OOOOOOOOOO
电感
Inductor 3
镀镍层
Nickel Plating
OOOOOOOOOO
电感
Inductor 4
镀镍层
Nickel Plating
OOOOOOOOOO
电感
Inductor 5
镀镍层
Nickel Plating
OOOOOOOOOO
电感
Inductor 6
镀铜
Copper Plating
OOOOOOOOOO

镀镍层
Nickel Plating
OOOOOOOOOO
电阻
Resistor 1
镀镍层
Nickel Plating
OOOOOOOOOO
电阻
Resistor 2
镀镍层
Nickel Plating
OOOOOOOOOO
电阻
Resistor 3
镀镍层
Nickel Plating
OOOOOOOOOO
电阻
Resistor 4
镀镍层
Nickel Plating
OOOOOOOOOO
电阻
Resistor 5
镀镍层
Nickel Plating
OOOOOOOOOO
电阻
Resistor 6
镀镍层
Nickel Plating
OOOOOOOOOO
电阻
Resistor 7
镀镍层
Nickel Plating
OOOOOOOOOO
电阻
Resistor 8
镀镍层
Nickel Plating
OOOOOOOOOO
电阻
Resistor 9
镀镍层
Nickel Plating
OOOOOOOOOO
半导体芯片
Semiconductor Die 1
镀镍层
Nickel Plating
OOOOOOOOOO
半导体芯片
Semiconductor Die 2
模具基板
Die Substrate
OOOOOOOOOO
半导体芯片
Semiconductor Die 3
模具基板
Die Substrate
OOOOOOOOOO
基材,预镀金
Substrate, Pre-plated Au
镀铜
Copper Plating
OOOOOOOOOO

镀金材料
Gold Plating
OOOOOOOOOO

阻焊层
Solder Mask
OOOOOOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A5M36SG239T2Last Revision (GMT):
Thursday, 20 November 2025, 12:34:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
25 Jun 2025
Test Report
25 Jun 2025
Test Report
25 Jun 2025
Test Report
25 Jun 2025
Capacitor 1CERAMICTest Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 2CERAMICTest Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 3CERAMICTest Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 4CERAMICTest Report
27 Oct 2025
Test Report
27 Oct 2025
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 5CERAMICTest Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 6CERAMICTest Report
27 Oct 2025
Test Report
27 Oct 2025
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Not Available
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 7CERAMICTest Report
27 Oct 2025
Test Report
27 Oct 2025
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 8CERAMICTest Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 9CERAMICTest Report
27 Oct 2025
Test Report
27 Oct 2025
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 10CERAMICTest Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 11CERAMICTest Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 12CERAMICTest Report
27 Oct 2025
Test Report
27 Oct 2025
Not AvailableNot Available
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Not AvailableNot Available
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Not AvailableNot Available
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGNot AvailableNot AvailableNot AvailableNot Available
Capacitor 13CERAMICTest Report
27 Oct 2025
Test Report
27 Oct 2025
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 14CERAMICTest Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Capacitor 15CERAMICTest Report
27 Oct 2025
Test Report
27 Oct 2025
Test Report
8 Nov 2024
Test Report
8 Nov 2024
INNER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
Test Report
21 Aug 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Die EncapsulantTest Report
16 Jan 2025
Test Report
16 Jan 2025
Test Report
16 Jan 2025
Test Report
16 Jan 2025
Epoxy AdhesiveTest Report
25 Jul 2025
Test Report
25 Jul 2025
Test Report
25 Jul 2025
Test Report
25 Jul 2025
Inductor 1ELECTRODETest Report
24 Apr 2025
Test Report
24 Apr 2025
Test Report
24 Apr 2025
Test Report
24 Apr 2025
INNER GLAZETest Report
6 Aug 2025
Test Report
6 Aug 2025
Not AvailableNot Available
NI PLATINGNot AvailableNot AvailableTest Report
28 Mar 2025
Not Available
OUTER GLAZETest Report
4 Oct 2024
Test Report
4 Oct 2024
Not AvailableNot Available
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Inductor 2ELECTRODETest Report
24 Apr 2025
Test Report
24 Apr 2025
Test Report
24 Apr 2025
Test Report
24 Apr 2025
INNER GLAZETest Report
6 Aug 2025
Test Report
6 Aug 2025
Test Report
6 Aug 2025
Test Report
6 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER GLAZETest Report
18 Sep 2025
Test Report
18 Sep 2025
Test Report
18 Sep 2025
Test Report
18 Sep 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Inductor 3ELECTRODETest Report
24 Apr 2025
Test Report
24 Apr 2025
Not AvailableNot Available
INNER GLAZETest Report
6 Aug 2025
Test Report
6 Aug 2025
Not AvailableNot Available
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER GLAZETest Report
18 Sep 2025
Test Report
18 Sep 2025
Not AvailableNot Available
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Inductor 4ELECTRODETest Report
24 Apr 2025
Test Report
24 Apr 2025
Test Report
24 Apr 2025
Test Report
24 Apr 2025
INNER GLAZETest Report
6 Aug 2025
Test Report
6 Aug 2025
Test Report
6 Aug 2025
Test Report
6 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER GLAZETest Report
18 Sep 2025
Test Report
18 Sep 2025
Test Report
18 Sep 2025
Test Report
18 Sep 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Inductor 5ELECTRODETest Report
24 Apr 2025
Test Report
24 Apr 2025
Not AvailableNot Available
INNER GLAZETest Report
6 Aug 2025
Test Report
6 Aug 2025
Not AvailableNot Available
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Not Available
OUTER GLAZETest Report
18 Sep 2025
Test Report
18 Sep 2025
Not AvailableNot Available
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Not Available
Inductor 6CERAMICTest Report
24 Oct 2024
Test Report
24 Oct 2024
Test Report
24 Oct 2024
Test Report
24 Oct 2024
CU PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
CU WIRETest Report
5 Aug 2025
Test Report
5 Aug 2025
Test Report
5 Aug 2025
Test Report
5 Aug 2025
NI PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
OUTER ELECTRODETest Report
24 Apr 2025
Test Report
24 Apr 2025
Test Report
24 Apr 2025
Test Report
24 Apr 2025
RESINTest Report
27 Mar 2025
Test Report
27 Mar 2025
Test Report
27 Mar 2025
Test Report
27 Mar 2025
SN PLATINGTest Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
Test Report
28 Mar 2025
WIRE COATINGTest Report
5 Aug 2025
Test Report
5 Aug 2025
Test Report
5 Aug 2025
Test Report
5 Aug 2025
Resistor 1BOTTOM CONDUCTORNot AvailableNot AvailableNot AvailableNot Available
CONDUCTORNot AvailableNot AvailableNot AvailableNot Available
NI PLATINGNot AvailableNot AvailableNot AvailableNot Available
OVERCOATNot AvailableNot AvailableNot AvailableNot Available
OVERGLAZENot AvailableNot AvailableNot AvailableNot Available
RESISTIVE ELECTRODENot AvailableNot AvailableNot AvailableNot Available
SN PLATINGNot AvailableNot AvailableNot AvailableNot Available
SPUTTERNot AvailableNot AvailableNot AvailableNot Available
SUBSTRATENot AvailableNot AvailableNot AvailableNot Available
TOP CONDUCTORNot AvailableNot AvailableNot AvailableNot Available
Resistor 2BOTTOM CONDUCTORTest Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
CONDUCTORTest Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
NI PLATINGTest Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
OVERCOATTest Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
18 Oct 2023
OVERGLAZETest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
RESISTIVE ELECTRODETest Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
SN PLATINGTest Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
SPUTTERTest Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
SUBSTRATETest Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
26 Dec 2023
TOP CONDUCTORTest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
Resistor 3BOTTOM CONDUCTORTest Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
CONDUCTORTest Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
NI PLATINGTest Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
OVERCOATTest Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
18 Oct 2023
OVERGLAZETest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
RESISTIVE ELECTRODETest Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
SN PLATINGTest Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
SPUTTERTest Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
SUBSTRATETest Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
26 Dec 2023
TOP CONDUCTORTest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
Resistor 4BOTTOM CONDUCTORTest Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
CONDUCTORTest Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
NI PLATINGTest Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
OVERCOATTest Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
18 Oct 2023
OVERGLAZETest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
RESISTIVE ELECTRODETest Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
SN PLATINGTest Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
SPUTTERTest Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
SUBSTRATETest Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
26 Dec 2023
TOP CONDUCTORTest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
Resistor 5BOTTOM CONDUCTORTest Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
CONDUCTORTest Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
NI PLATINGTest Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
OVERCOATTest Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
18 Oct 2023
OVERGLAZETest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
RESISTIVE ELECTRODETest Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
SN PLATINGTest Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
SPUTTERTest Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
SUBSTRATETest Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
26 Dec 2023
TOP CONDUCTORTest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
Resistor 6BOTTOM CONDUCTORNot AvailableNot AvailableNot AvailableNot Available
CONDUCTORNot AvailableNot AvailableNot AvailableNot Available
NI PLATINGNot AvailableNot AvailableNot AvailableNot Available
OVERCOATNot AvailableNot AvailableNot AvailableNot Available
OVERGLAZENot AvailableNot AvailableNot AvailableNot Available
RESISTIVE ELECTRODENot AvailableNot AvailableNot AvailableNot Available
SN PLATINGNot AvailableNot AvailableNot AvailableNot Available
SPUTTERNot AvailableNot AvailableNot AvailableNot Available
SUBSTRATETest Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
26 Dec 2023
TOP CONDUCTORNot AvailableNot AvailableNot AvailableNot Available
Resistor 7BOTTOM CONDUCTORTest Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
CONDUCTORTest Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
NI PLATINGTest Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
OVERCOATTest Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
18 Oct 2023
OVERGLAZETest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
RESISTIVE ELECTRODETest Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
SN PLATINGTest Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
SPUTTERTest Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
SUBSTRATETest Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
26 Dec 2023
TOP CONDUCTORTest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
Resistor 8BOTTOM CONDUCTORNot AvailableNot AvailableNot AvailableNot Available
CONDUCTORNot AvailableNot AvailableNot AvailableNot Available
NI PLATINGNot AvailableNot AvailableNot AvailableNot Available
OVERCOATNot AvailableNot AvailableNot AvailableNot Available
OVERGLAZENot AvailableNot AvailableNot AvailableNot Available
RESISTIVE ELECTRODENot AvailableNot AvailableNot AvailableNot Available
SN PLATINGNot AvailableNot AvailableNot AvailableNot Available
SPUTTERNot AvailableNot AvailableNot AvailableNot Available
SUBSTRATETest Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
26 Dec 2023
TOP CONDUCTORNot AvailableNot AvailableNot AvailableNot Available
Resistor 9BOTTOM CONDUCTORTest Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
Test Report
21 Jul 2025
CONDUCTORTest Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
Test Report
4 Jul 2025
NI PLATINGTest Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
Test Report
26 Jun 2025
OVERCOATTest Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
18 Oct 2023
OVERGLAZETest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
RESISTIVE ELECTRODETest Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
Test Report
21 Oct 2024
SN PLATINGTest Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
Test Report
10 Jul 2025
SPUTTERTest Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
Test Report
6 Feb 2025
SUBSTRATETest Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
17 Dec 2024
Test Report
26 Dec 2023
TOP CONDUCTORTest Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
13 Nov 2024
Test Report
15 Nov 2023
Semiconductor Die 1Test Report
5 Jun 2025
Test Report
5 Jun 2025
Test Report
5 Jun 2025
Test Report
5 Jun 2025
Semiconductor Die 2Test Report
5 Jun 2025
Test Report
5 Jun 2025
Test Report
5 Jun 2025
Test Report
5 Jun 2025
Semiconductor Die 3CU PILLARTest Report
17 Sep 2025
Test Report
17 Sep 2025
Test Report
17 Sep 2025
Test Report
17 Sep 2025
DIETest Report
1 Jul 2025
Test Report
1 Jul 2025
Test Report
1 Jul 2025
Test Report
1 Jul 2025
NI PLATINGTest Report
29 Apr 2025
Test Report
29 Apr 2025
Test Report
29 Apr 2025
Test Report
29 Apr 2025
SOLDERTest Report
15 Jan 2025
Test Report
15 Jan 2025
Test Report
15 Jan 2025
Not Available
UBM CUTest Report
17 Jun 2025
Test Report
17 Jun 2025
Test Report
17 Jun 2025
Test Report
17 Jun 2025
UBM TITest Report
17 Jan 2025
Test Report
17 Jan 2025
Test Report
17 Jan 2025
Test Report
17 Jan 2025
Semiconductor Die 4Not AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 5Not AvailableNot AvailableNot AvailableNot Available
Solder PasteTest Report
24 Oct 2024
Test Report
24 Oct 2024
Test Report
24 Oct 2024
Test Report
24 Oct 2024
Substrate, Pre-plated AuAUS SR1Not AvailableNot AvailableNot AvailableNot Available
CU FOILTest Report
18 Nov 2025
Test Report
18 Nov 2025
Test Report
18 Nov 2025
Not Available
GHPL-970LFTest Report
6 Nov 2025
Test Report
6 Nov 2025
Test Report
6 Nov 2025
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.