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OM13495
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Surface Mount to DIP Evaluation Board.
OM13495使您将封装引线分到100密尔中心引脚来评估小型表面贴装器件,从而模拟DIP封装。OM13495支持以下封装:TSSOP24、(SOT355)、TSSOP20、(SOT360)、TSSOP16、(SOT403)、TSSOP14和(SOT402)。
Surface Mount to DIP Evaluation Board.
Distributor Name | 地区 | 库存 | 库存日期 |
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Upon selection of a preferred distributor, you will be directed to their web site to place and service your order. Please be aware that distributors are independent businesses and set their own prices, terms and conditions of sale. NXP makes no representations or warranties, express or implied, about distributors, or the prices, terms and conditions of sale agreed upon by you and any distributor.
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