表面贴装到DIP评估板

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产品详情

功能

连接

  • 采用附加的I²C子卡扩展套件
  • 轻松连接到小型表面贴装封装

主要功能

  • 可评估仅采用表面贴装封装的器件
  • 100密尔中心接头模拟DIP封装,可轻松进行模拟板试验
  • 消除昂贵的插座和定制的印刷电路板
N true 0 TSPOM13492zh 1 用户指南 User Guide t792 1 zh zh 1 1 2.0 English Technical information for breakout boards allowing I2C-bus surface mount components to be easily evaluated 1442125526280711530607 TSP 2.6 MB Registration without Disclaimer None documents Y Extended 1442125526280711530607 /secured/assets/documents/en/user-guide/UM10754.pdf 2632913 /secured/assets/documents/en/user-guide/UM10754.pdf UM10754 Y N 2018-10-19 OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board /webapp/Download?colCode=UM10754&docLang=en /secured/assets/documents/en/user-guide/UM10754.pdf User Guide N 132339537837198660 2024-10-01 pdf Y en Oct 4, 2018 User Guide t792 用户指南 User Guide Y N OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board false zh false 0 OM13492 downloads zh-Hans true 0 Y TSP 用户指南 1 /secured/assets/documents/en/user-guide/UM10754.pdf 2018-10-19 1442125526280711530607 TSP 1 Oct 4, 2018 User Guide 用户指南 Technical information for breakout boards allowing I2C-bus surface mount components to be easily evaluated Y Registration without Disclaimer /secured/assets/documents/en/user-guide/UM10754.pdf English 2632913 None User Guide 2024-10-01 Y /webapp/Download?colCode=UM10754&docLang=en OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board /secured/assets/documents/en/user-guide/UM10754.pdf documents 132339537837198660 User Guide N en Extended Y t792 pdf 2.0 Y N OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board 2.6 MB UM10754 N 1442125526280711530607 true Y Tools

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