Building on the success of NXP's TEF660x and TEF661x families, the TEF662x uses a low-IF architecture to ensure high integration with low complexity. The result is easy design-in and good price/performance ratios.

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plastic small outline package; 32 leads; body width 7.5 mm[SOT287-1]

PDFJun 8, 2016版本更新 1.0

Footprint for Wave Soldering[SO-SOJ-WAVE]

PDFOct 8, 2009版本更新 1.0

NXP low-IF analog car radio

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plastic small outline package; 32 leads; body width 7.5 mm[SOT287-1]

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Footprint for Wave Soldering[SO-SOJ-WAVE]

plastic small outline package; 32 leads; body width 7.5 mm

Footprint for Wave Soldering

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