The NXP® SCBGADAWT is a Ball Grid Array (BGA) socket adapter set which allows any 416-pin 1.0 mm pitch MAP PBGA surface mount device to be installed into a user's target system. The SCBGADAWT socket adapter set consists of an Enplas 416-pin Zero Insertion Force (ZIF) BGA socket, an SCBGAMWT PGA mini-grid socket, a PGA mini-grid socket adapter, and an SCBGARBWA BGA base with receivers. The SCBGARBWA BGA base with receivers is reflowed in the user's target hardware in place of the 416-pin device. The Enplas 416-pin (ZIF) BGA socket is inserted into the SCBGAMWT PGA mini-grid socket, which protects the pins on the BGA ZIF socket. The PGA mini-grid socket adapter is installed into the SCBGARBWA BGA base with receivers. This adapts the 1.0 mm receiver to the 1.2 mm pins on the SCBGAMWT PGA mini-grid socket. The socket assembly is then inserted into the SCBGARBWA BGA base with receivers. A 416-pin 1.0 mm pitch MAP PBGA device can then be installed into the BGA ZIF socket. The SCBGADAWT socket adapter set provides an effective tool for device evaluation and analysis. The SCBGADAWT supports not only fully balled parts, but has also proven effective for partially de-balled or LGA devices, making it quite useful for failure analysis activities.
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