封装信息 (2)
-
Bare die; 80 bonding pads[OL-PCA9620U]
应用笔记 (4)
手册 (1)
支持信息 (1)
-
Footprint for wave soldering[HTQFP-HLQFP-LQFP-MSQFP-WAVE]
|
|
|
|
|
|
|
|---|---|---|---|---|---|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
快速参考恩智浦 文档类别
1-10 / 15 文件
紧凑列表
安全文件正在加载,请稍等