S32G398AACK1VUCR

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of S32G398AACK1VUCRLast Revision (GMT):
Monday, 06 May 2024, 09:45:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
S32G398AACK1VUCRSOT1655FBGA5251788.180000 mg YesYesYesTin/Silver (Sn/Ag)Not Applicablee2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 404 315182023-11-2443 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-75.94840040.0000000.332651
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-62.23065015.0000000.124744
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-26.69195045.0000000.374233
Subtotal14.871000100.00000000.831628
Heat SpreaderCopper AlloyCopper and its compoundsCopper, metal7440-50-81515.59447099.99000084.756259
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1515750.0100000.008476
Subtotal1515.746045100.000000084.764735
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0023860.0100000.000133
Nickel and its compoundsNickel, metal7440-02-023.86156999.9900001.334405
Subtotal23.863955100.00000001.334539
Semiconductor DieDieInorganic Silicon compoundsSilicon, doped62.46016089.6000003.492946
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.6273900.9000000.035085
Nickel and its compoundsNickel, metal7440-02-00.3485500.5000000.019492
Silver and its compoundsSilver, metal7440-22-40.2195860.3150000.012280
Tin and its compoundsTin, metal7440-31-56.0543148.6850000.338574
Subtotal69.710000100.00000003.898377
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-44.5251853.5000000.253061
Tin and its compoundsTin, metal7440-31-5124.76581596.5000006.977252
Subtotal129.291000100.00000007.230312
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-517.84448072.0000000.997913
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4956802.0000000.027720
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones1.9827208.0000000.110879
Zinc and its compoundsZinc oxide1314-13-24.46112018.0000000.249478
Subtotal24.784000100.00000001.385990
UnderfillUnderfillAromatic amines and their salts6-methyl-2,4-bis(methylthio)phenylene-1,3-diamine106264-79-30.2081742.0998000.011642
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-60.3469603.4997000.019403
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.88347218.9981000.105329
Inorganic Silicon compoundsSilica, vitreous60676-86-06.64170666.9932000.371423
Inorganic compoundsCarbon Black1333-86-40.0079310.0800000.000443
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1823981.8398000.010200
Organic compoundsOther organic compounds.0.6245226.2994000.034925
Phosphorus compoundsTriphenyl phosphine603-35-00.0188370.1900000.001053
Subtotal9.914000100.00000000.554419
Total1788.180000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 S32G398AACK1VUCR
Product content declaration of S32G398AACK1VUCR
上次修订 Last Revision (GMT):
Monday, 06 May 2024, 09:45:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
铜合金
Copper Alloy
OOOOOO

镀镍层
Nickel Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of S32G398AACK1VUCRLast Revision (GMT):
Monday, 06 May 2024, 09:45:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Heat SpreaderCOPPER ALLOYTest Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
NI PLATINGTest Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.