MK22FN256VDC12

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MK22FN256VDC12Last Revision (GMT):
Wednesday, 06 March 2024, 08:16:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MK22FN256VDC12SOT1557XFBGA12167.436175 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 182 675572023-11-24103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.78481098.0994001.163782
Gold and its compoundsGold, metal7440-57-50.0008000.1000000.001186
Palladium and its compoundsPalladium, metal7440-05-30.0144051.8006000.021361
Subtotal0.800015100.00000001.186329
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins1.5600006.0000002.313299
Inorganic Silicon compoundsSilica, vitreous60676-86-019.24000074.00000028.530681
Inorganic Silicon compoundsSilicon dioxide7631-86-93.90000015.0000005.783246
Inorganic compoundsCarbon Black1333-86-40.1300000.5000000.192775
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.5200002.0000000.771100
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.6500002.5000000.963874
Subtotal26.000000100.000000038.554975
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.07000010.0000000.103802
Inorganic Silicon compoundsSilicon dioxide7631-86-90.17500025.0000000.259505
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.21000030.0000000.311406
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.17500025.0000000.259505
PolymersAcrylic acid ester copolymer78506-70-40.07000010.0000000.103802
Subtotal0.700000100.00000001.038019
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped17.35889798.00000025.741224
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3542632.0000000.525331
Subtotal17.713160100.000000026.266555
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0186600.5012000.027670
Silver and its compoundsSilver, metal7440-22-40.0373191.0024000.055340
Tin and its compoundsTin, metal7440-31-53.66702198.4964005.437765
Subtotal3.723000100.00000005.520776
Substrate, Pre-plated NiAuCopper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0001690.0050000.000251
Copper and its compoundsCopper, metal7440-50-83.38111299.9250005.013796
Nickel and its compoundsNickel, metal7440-02-00.0006770.0200000.001004
Zinc and its compoundsZinc, metal7440-66-60.0016920.0500000.002509
Subtotal3.383650100.00000005.017559
Copper PlatingCopper and its compoundsCopper, metal7440-50-85.35039499.9000007.934012
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0053560.1000000.007942
Subtotal5.355750100.00000007.941954
Gold PlatingGold and its compoundsGold, metal7440-57-50.45649399.9000000.676926
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0004570.1000000.000678
Subtotal0.456950100.00000000.677604
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0021150.1000000.003136
Nickel and its compoundsNickel, metal7440-02-02.11243599.9000003.132496
Subtotal2.114550100.00000003.135632
Solder MaskBarium and its compoundsBarium sulfate7727-43-71.02555729.1000001.520781
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0211460.6000000.031356
Magnesium and its compoundsTalc14807-96-60.1057283.0000000.156782
Organic compoundsOther organic compounds.0.1268733.6000000.188138
PolymersPlastic: EP - Epoxide, Epoxy0.69075319.6000001.024306
PolymersPlastic: PAK1.55419444.1000002.304689
Subtotal3.524250100.00000005.226053
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-60.79893721.8000001.184731
Inorganic Silicon compoundsFibrous-glass-wool65997-17-31.64185344.8000002.434677
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0439781.2000000.065215
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2345506.4000000.347811
Phenols - SpecificBisphenol A80-05-70.0366491.0000000.054345
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)0.52773814.4000000.782575
PolymersPlastic: EP - Epoxide, Epoxy0.38114410.4000000.565193
Subtotal3.664850100.00000005.434546
Total67.436175100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MK22FN256VDC12
Product content declaration of MK22FN256VDC12
上次修订 Last Revision (GMT):
Wednesday, 06 March 2024, 08:16:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MK22FN256VDC12Last Revision (GMT):
Wednesday, 06 March 2024, 08:16:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
AUS308Test Report
22 Aug 2022
Test Report
22 Aug 2022
Test Report
22 Aug 2022
Test Report
22 Aug 2022
COPPER FOILTest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
CU PLATINGTest Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
HL832NXATest Report
8 Feb 2023
Test Report
8 Feb 2023
Test Report
11 Mar 2022
Test Report
8 Feb 2023
NI PLATINGTest Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.