AFSC5G35D37T2

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

European RoHS

Chinese RoHS

NXP Semiconductors
Product content declaration of AFSC5G35D37T2		Last Revision (GMT): Wednesday, 12 June 2024, 02:22:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G35D37T2	SOT1831	HLLGA27	211.159054 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Gold (Ni/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9353 694 13528	2023-11-24	8	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.069117	99.990000	0.032732
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.010000	0.000003
			Subtotal		0.069124	100.0000000	0.032736

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.011369
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.002274
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.004548
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.027287
			Subtotal		0.096030	100.0000000	0.045478
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.001891
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000002
			Subtotal		0.003996	100.0000000	0.001892
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.002836
			Subtotal		0.005994	100.0000000	0.002839
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000568
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.025571
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.002273
			Subtotal		0.059994	100.0000000	0.028412
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000007
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.006617
			Subtotal		0.013986	100.0000000	0.006623

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.011369
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.002274
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.004548
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.027287
			Subtotal		0.096030	100.0000000	0.045478
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.001891
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000002
			Subtotal		0.003996	100.0000000	0.001892
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.002836
			Subtotal		0.005994	100.0000000	0.002839
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000568
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.025571
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.002273
			Subtotal		0.059994	100.0000000	0.028412
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000007
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.006617
			Subtotal		0.013986	100.0000000	0.006623

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	6.230983	25.000000	2.950848
		Manganese and its compounds	Manganese oxide	1344-43-0	1.246196	5.000000	0.590170
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		2.492393	10.000000	1.180339
		Zirconium and its compounds	Zirconium oxide	1314-23-4	14.954359	60.000000	7.082035
			Subtotal		24.923931	100.0000000	11.803392
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	1.048108	99.990000	0.496360
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000105	0.010000	0.000050
			Subtotal		1.048213	100.0000000	0.496409
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000082	0.010000	0.000039
		Nickel and its compounds	Nickel, metal	7440-02-0	0.815182	99.990000	0.386051
			Subtotal		0.815264	100.0000000	0.386090
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.186347	2.000000	0.088250
		Copper and its compounds	Copper, metal	7440-50-8	8.385611	90.000000	3.971230
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.745388	8.000000	0.352998
			Subtotal		9.317346	100.0000000	4.412478
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000233	0.010000	0.000110
		Tin and its compounds	Tin, metal	7440-31-5	2.329104	99.990000	1.103009
			Subtotal		2.329337	100.0000000	1.103119

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.097177	25.000000	0.046021
		Manganese and its compounds	Manganese oxide	1344-43-0	0.019435	5.000000	0.009204
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.038871	10.000000	0.018408
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.233225	60.000000	0.110450
			Subtotal		0.388708	100.0000000	0.184083
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.016159	99.900000	0.007652
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000016	0.100000	0.000008
			Subtotal		0.016175	100.0000000	0.007660
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000024	0.100000	0.000012
		Nickel and its compounds	Nickel, metal	7440-02-0	0.024238	99.900000	0.011479
			Subtotal		0.024262	100.0000000	0.011490
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.004857	2.000000	0.002300
		Copper and its compounds	Copper, metal	7440-50-8	0.218558	90.000000	0.103504
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.019427	8.000000	0.009200
			Subtotal		0.242842	100.0000000	0.115004
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000057	0.100000	0.000027
		Tin and its compounds	Tin, metal	7440-31-5	0.056556	99.900000	0.026783
			Subtotal		0.056612	100.0000000	0.026810

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	6.230983	25.000000	2.950848
		Manganese and its compounds	Manganese oxide	1344-43-0	1.246196	5.000000	0.590170
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		2.492393	10.000000	1.180339
		Zirconium and its compounds	Zirconium oxide	1314-23-4	14.954359	60.000000	7.082035
			Subtotal		24.923931	100.0000000	11.803392
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	1.048108	99.990000	0.496360
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000105	0.010000	0.000050
			Subtotal		1.048213	100.0000000	0.496409
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000082	0.010000	0.000039
		Nickel and its compounds	Nickel, metal	7440-02-0	0.815182	99.990000	0.386051
			Subtotal		0.815264	100.0000000	0.386090
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.186347	2.000000	0.088250
		Copper and its compounds	Copper, metal	7440-50-8	8.385611	90.000000	3.971230
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.745388	8.000000	0.352998
			Subtotal		9.317346	100.0000000	4.412478
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000233	0.010000	0.000110
		Tin and its compounds	Tin, metal	7440-31-5	2.329104	99.990000	1.103009
			Subtotal		2.329337	100.0000000	1.103119

Die Encapsulant	Die Encapsulant	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	51.395400	90.000000	24.339662
		Inorganic compounds	Carbon Black	1333-86-4	0.285530	0.500000	0.135220
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		5.425070	9.500000	2.569186
			Subtotal		57.106000	100.0000000	27.044069

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.099826	3.061200	0.047275
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.099826	3.061200	0.047275
		Silver and its compounds	Silver, metal	7440-22-4	3.061349	93.877600	1.449783
			Subtotal		3.261000	100.0000000	1.544333

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.019500
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.004875
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.024375
			Subtotal		0.102940	100.0000000	0.048750
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.009749
			Subtotal		0.020589	100.0000000	0.009750
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.003217
			Subtotal		0.006794	100.0000000	0.003217
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.013161
			Subtotal		0.027793	100.0000000	0.013162
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.000185
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.000556
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.000185
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.002594
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.000185
			Subtotal		0.007826	100.0000000	0.003706
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.004289
			Subtotal		0.009058	100.0000000	0.004290

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041177	40.000000	0.019500
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.004875
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.051471	50.000000	0.024375
			Subtotal		0.102942	100.0000000	0.048751
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000021	0.100000	0.000010
		Silver and its compounds	Silver, metal	7440-22-4	0.020568	99.900000	0.009741
			Subtotal		0.020589	100.0000000	0.009750
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000007	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006787	99.900000	0.003214
			Subtotal		0.006794	100.0000000	0.003217
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000028	0.100000	0.000013
		Silver and its compounds	Silver, metal	7440-22-4	0.027766	99.900000	0.013149
			Subtotal		0.027793	100.0000000	0.013162
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000391	5.000000	0.000185
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.000556
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.000185
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005477	70.000000	0.002594
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000391	5.000000	0.000185
			Subtotal		0.007824	100.0000000	0.003706
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000009	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.009049	99.900000	0.004285
			Subtotal		0.009058	100.0000000	0.004290

Inductor 3	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.023868	99.990000	0.011303
			Subtotal		0.023870	100.0000000	0.011304
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.047719	40.000000	0.022599
		Boron and its compounds	Boron oxide	1303-86-2	0.011930	10.000000	0.005650
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.059649	50.000000	0.028248
			Subtotal		0.119298	100.0000000	0.056497
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003184	99.990000	0.001508
			Subtotal		0.003185	100.0000000	0.001508
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.015906	99.990000	0.007533
			Subtotal		0.015908	100.0000000	0.007534
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000398	5.000000	0.000189
		Boron and its compounds	Boron oxide	1303-86-2	0.001194	15.000000	0.000566
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000398	5.000000	0.000189
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005574	70.000000	0.002640
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000398	5.000000	0.000189
			Subtotal		0.007963	100.0000000	0.003771
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.004777	99.990000	0.002262
			Subtotal		0.004777	100.0000000	0.002263

Inductor 4	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041177	40.000000	0.019500
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.004875
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.051471	50.000000	0.024375
			Subtotal		0.102942	100.0000000	0.048751
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000391	5.000000	0.000185
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.000556
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.000185
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005477	70.000000	0.002594
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000391	5.000000	0.000185
			Subtotal		0.007824	100.0000000	0.003706
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000021	0.100000	0.000010
		Silver and its compounds	Silver, metal	7440-22-4	0.020568	99.900000	0.009741
			Subtotal		0.020589	100.0000000	0.009750
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000007	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006787	99.900000	0.003214
			Subtotal		0.006794	100.0000000	0.003217
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000028	0.100000	0.000013
		Silver and its compounds	Silver, metal	7440-22-4	0.027766	99.900000	0.013149
			Subtotal		0.027793	100.0000000	0.013162
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000009	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.009049	99.900000	0.004285
			Subtotal		0.009058	100.0000000	0.004290

Inductor 5	Ceramic 1	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000398	5.000000	0.000189
		Boron and its compounds	Boron oxide	1303-86-2	0.001194	15.000000	0.000566
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000398	5.000000	0.000189
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005574	70.000000	0.002640
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000398	5.000000	0.000189
			Subtotal		0.007963	100.0000000	0.003771
	Ceramic 2	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.047719	40.000000	0.022599
		Boron and its compounds	Boron oxide	1303-86-2	0.011930	10.000000	0.005650
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.059649	50.000000	0.028248
			Subtotal		0.119298	100.0000000	0.056497
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.023868	99.990000	0.011303
			Subtotal		0.023870	100.0000000	0.011304
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003184	99.990000	0.001508
			Subtotal		0.003185	100.0000000	0.001508
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.015906	99.990000	0.007533
			Subtotal		0.015908	100.0000000	0.007534
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.004777	99.990000	0.002262
			Subtotal		0.004777	100.0000000	0.002263

Inductor 6	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.019500
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.004875
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.024375
			Subtotal		0.102940	100.0000000	0.048750
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.009749
			Subtotal		0.020589	100.0000000	0.009750
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.003217
			Subtotal		0.006794	100.0000000	0.003217
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.013161
			Subtotal		0.027793	100.0000000	0.013162
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.000185
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.000556
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.000185
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.002594
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.000185
			Subtotal		0.007826	100.0000000	0.003706
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.004289
			Subtotal		0.009058	100.0000000	0.004290

Resistor	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.025214	96.100000	0.011941
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000105	0.400000	0.000050
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000394	1.500000	0.000186
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000525	2.000000	0.000249
			Subtotal		0.026238	100.0000000	0.012426
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000065
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000006
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000022
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.000381
			Subtotal		0.001000	100.0000000	0.000474
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000021
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000001
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000013
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000017
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.000421
			Subtotal		0.001000	100.0000000	0.000474
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000079
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000020
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000250	25.000000	0.000118
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.000541	54.100000	0.000256
			Subtotal		0.001000	100.0000000	0.000474
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001856	99.990000	0.000879
			Subtotal		0.001857	100.0000000	0.000879
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000032
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.000358
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000005
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000080
			Subtotal		0.001000	100.0000000	0.000474
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000078	5.510000	0.000037
		Boron and its compounds	Boron oxide	1303-86-2	0.000013	0.900000	0.000006
		Copper and its compounds	Cupric oxide	1317-38-0	0.000013	0.900000	0.000006
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000275	19.540000	0.000130
		Lead and its compounds	Lead monooxide	1317-36-8	0.000080	5.650000	0.000038
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000025	1.800000	0.000012
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000127	9.020000	0.000060
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000127	9.020000	0.000060
		Silver and its compounds	Silver, metal	7440-22-4	0.000607	43.050000	0.000287
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000040	2.810000	0.000019
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000025	1.800000	0.000012
			Subtotal		0.001410	100.0000000	0.000668
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000166
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000308
			Subtotal		0.001000	100.0000000	0.000474
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.002785	99.990000	0.001319
			Subtotal		0.002786	100.0000000	0.001319

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	25.528205	89.600000	12.089562
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.256422	0.900000	0.121435
		Nickel and its compounds	Nickel, metal	7440-02-0	0.142457	0.500000	0.067464
		Silver and its compounds	Silver, metal	7440-22-4	0.089748	0.315000	0.042502
		Tin and its compounds	Tin, metal	7440-31-5	2.474469	8.685000	1.171851
			Subtotal		28.491300	100.0000000	13.492815

Semiconductor Die 2	Die	Gold and its compounds	Gold, metal	7440-57-5	0.010811	2.000000	0.005120
		Inorganic Silicon compounds	Silicon, doped		0.529749	98.000000	0.250877
			Subtotal		0.540560	100.0000000	0.255997

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.004790	0.540000	0.002268
		Silver and its compounds	Silver, metal	7440-22-4	0.028916	3.260000	0.013694
		Tin and its compounds	Tin, metal	7440-31-5	0.853294	96.200000	0.404100
			Subtotal		0.887000	100.0000000	0.420062

Substrate, Pre-plated NiAu	Substrate, Pre-plated NiAu	Barium and its compounds	Barium sulfate	7727-43-7	0.761661	1.823900	0.360705
		Copper and its compounds	Copper, metal	7440-50-8	22.569651	54.046100	10.688460
		Epoxy Resins	Other Epoxy resins		2.459664	5.890000	1.164840
		Gold and its compounds	Gold, metal	7440-57-5	0.423739	1.014700	0.200673
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	5.289697	12.666900	2.505077
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	6.347645	15.200300	3.006097
		Nickel and its compounds	Nickel, metal	7440-02-0	3.907943	9.358100	1.850710
			Subtotal		41.760000	100.0000000	19.776562

			Total		211.159054	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G35D37T2 Product content declaration of AFSC5G35D37T2		上次修订 Last Revision (GMT): Wednesday, 12 June 2024, 02:22:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 5	陶瓷的 Ceramic 1	O	O	O	O	O	O
	陶瓷的 Ceramic 2	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Die	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，镍金预镀 Substrate, Pre-plated NiAu	基板，镍金预镀 Substrate, Pre-plated NiAu	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G35D37T2		Last Revision (GMT): Wednesday, 12 June 2024, 02:22:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 13 Jul 2023	Test Report 13 Jul 2023	Test Report 13 Jul 2023	Test Report 13 Jul 2023
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 28 Jul 2023	Test Report 28 Jul 2023	Test Report 28 Jul 2023	Test Report 28 Jul 2023
Inductor 1	ELECTRODE	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE BB	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE BC	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 2	ELECTRODE	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE BB	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE BC	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 23 Apr 2023	Test Report 23 Apr 2023	Test Report 25 Jun 2021	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 3	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 4	ELECTRODE	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 5	ELECTRODE	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE BB	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE BC	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Not Available	Not Available	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Not Available	Not Available	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 6	ELECTRODE	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE BB	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE BC	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Resistor	ALUMINA	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	BOTTOM CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 1ST OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 2ND OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	NI PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TERMINAL CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TOP CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
Semiconductor Die 1	AU BUMPING	Not Available	Not Available	Not Available	Not Available
	DIE	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 2		Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023
Solder Paste		Test Report 12 Oct 2023	Test Report 12 Oct 2023	Not Available	Test Report 12 Oct 2023
Substrate, Pre-plated NiAu	AUS SR1	Test Report 23 Mar 2023	Test Report 23 Mar 2023	Test Report 23 Mar 2023	Test Report 23 Mar 2023
	COPPER FOIL	Test Report 7 Dec 2023	Test Report 7 Dec 2023	Test Report 7 Dec 2023	Test Report 7 Dec 2023
	E705G SERIES	Test Report 16 Mar 2023	Test Report 24 Mar 2022	Test Report 16 Mar 2023	Test Report 16 Mar 2023
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer