AFRX5G272T4

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Product content declaration of AFRX5G272T4		Last Revision (GMT): Tuesday, 23 April 2024, 10:49:00 PM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFRX5G272T4	SOT1996	HLFLGA21	142.065789 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Palladium/Gold (Ni/Pd/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 002 37528	2023-11-24	7	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.159583	99.990000	0.112330
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000016	0.010000	0.000011
			Subtotal		0.159599	100.0000000	0.112342

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	5.126147	25.000000	3.608291
		Manganese and its compounds	Manganese oxide	1344-43-0	1.025229	5.000000	0.721658
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		2.050459	10.000000	1.443316
		Zirconium and its compounds	Zirconium oxide	1314-23-4	12.302752	60.000000	8.659898
			Subtotal		20.504587	100.0000000	14.433163
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.852384	99.900000	0.599992
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000853	0.100000	0.000601
			Subtotal		0.853237	100.0000000	0.600593
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.001280	0.100000	0.000901
		Nickel and its compounds	Nickel, metal	7440-02-0	1.278575	99.900000	0.899988
			Subtotal		1.279855	100.0000000	0.900889
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.256202	2.000000	0.180340
		Copper and its compounds	Copper, metal	7440-50-8	11.529074	90.000000	8.115307
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	1.024807	8.000000	0.721361
			Subtotal		12.810083	100.0000000	9.017007
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.002986	0.100000	0.002102
		Tin and its compounds	Tin, metal	7440-31-5	2.983343	99.900000	2.099972
			Subtotal		2.986329	100.0000000	2.102075

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.057600	40.000000	0.040545
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.014400	10.000000	0.010136
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.072000	50.000000	0.050681
			Subtotal		0.144000	100.0000000	0.101362
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005999	99.990000	0.004223
			Subtotal		0.006000	100.0000000	0.004223
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008999	99.990000	0.006334
			Subtotal		0.009000	100.0000000	0.006335
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001800	2.000000	0.001267
		Copper and its compounds	Copper, metal	7440-50-8	0.081000	90.000000	0.057016
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007200	8.000000	0.005068
			Subtotal		0.090000	100.0000000	0.063351
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.020998	99.990000	0.014781
			Subtotal		0.021000	100.0000000	0.014782

Capacitor 3	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.264000	60.000000	0.185829
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.044000	10.000000	0.030972
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.132000	30.000000	0.092915
			Subtotal		0.440000	100.0000000	0.309716
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.015998	99.990000	0.011261
			Subtotal		0.016000	100.0000000	0.011262
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013999	99.990000	0.009854
			Subtotal		0.014000	100.0000000	0.009855
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.003040	2.000000	0.002140
		Copper and its compounds	Copper, metal	7440-50-8	0.136800	90.000000	0.096293
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.012160	8.000000	0.008559
			Subtotal		0.152000	100.0000000	0.106993
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.037996	99.990000	0.026745
			Subtotal		0.038000	100.0000000	0.026748

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.019200	40.000000	0.013515
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004800	10.000000	0.003379
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.024000	50.000000	0.016894
			Subtotal		0.048000	100.0000000	0.033787
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001999	99.990000	0.001408
			Subtotal		0.002000	100.0000000	0.001408
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002999	99.990000	0.002112
			Subtotal		0.003000	100.0000000	0.002112
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000422
		Copper and its compounds	Copper, metal	7440-50-8	0.027000	90.000000	0.019005
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001689
			Subtotal		0.030000	100.0000000	0.021117
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.006999	99.990000	0.004927
			Subtotal		0.007000	100.0000000	0.004927

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		2.975700	5.000000	2.094593
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	51.777180	87.000000	36.445917
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	1.785420	3.000000	1.256756
		Inorganic compounds	Carbon Black	1333-86-4	0.297570	0.500000	0.209459
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.059514	0.100000	0.041892
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.773682	1.300000	0.544594
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		1.785420	3.000000	1.256756
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.059514	0.100000	0.041892
			Subtotal		59.514000	100.0000000	41.891859

Epoxy Adhesive	Epoxy Adhesive	Anhydrides	Proprietary Material - Other anhydrides		0.008550	3.000000	0.006018
		Epoxy Resins	Proprietary Material-Other Epoxy resins		0.018525	6.500000	0.013040
		Organic Silicon compounds	(3,4-Epoxycyclohexyl)ethyltrimethoxysilane	3388-04-3	0.001425	0.500000	0.001003
		Silver and its compounds	Silver, metal	7440-22-4	0.256500	90.000000	0.180550
			Subtotal		0.285000	100.0000000	0.200611

Inductor 1	Ceramic 1	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000796	5.000000	0.000561
		Boron and its compounds	Boron oxide	1303-86-2	0.002389	15.000000	0.001681
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000796	5.000000	0.000561
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.011147	70.000000	0.007847
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000796	5.000000	0.000561
			Subtotal		0.015925	100.0000000	0.011210
	Ceramic 2	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.095438	40.000000	0.067179
		Boron and its compounds	Boron oxide	1303-86-2	0.023859	10.000000	0.016795
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.119298	50.000000	0.083973
			Subtotal		0.238595	100.0000000	0.167947
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000005	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.047735	99.990000	0.033601
			Subtotal		0.047740	100.0000000	0.033604
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006369	99.990000	0.004483
			Subtotal		0.006370	100.0000000	0.004484
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.031812	99.990000	0.022392
			Subtotal		0.031815	100.0000000	0.022395
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009554	99.990000	0.006725
			Subtotal		0.009555	100.0000000	0.006726

Inductor 2	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.009799	99.990000	0.006897
			Subtotal		0.009800	100.0000000	0.006898
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.043540	40.000000	0.030648
		Boron and its compounds	Boron oxide	1303-86-2	0.010885	10.000000	0.007662
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.054425	50.000000	0.038310
			Subtotal		0.108850	100.0000000	0.076619
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008399	99.990000	0.005912
			Subtotal		0.008400	100.0000000	0.005913
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000315	1.000000	0.000222
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002835	9.000000	0.001996
		Silver and its compounds	Silver, metal	7440-22-4	0.028350	90.000000	0.019956
			Subtotal		0.031500	100.0000000	0.022173
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000280	5.000000	0.000197
		Boron and its compounds	Boron oxide	1303-86-2	0.000840	15.000000	0.000591
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000280	5.000000	0.000197
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.003920	70.000000	0.002759
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000280	5.000000	0.000197
			Subtotal		0.005600	100.0000000	0.003942
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.010849	99.990000	0.007637
			Subtotal		0.010850	100.0000000	0.007637

Inductor 3	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.039196	99.990000	0.027590
			Subtotal		0.039200	100.0000000	0.027593
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.174160	40.000000	0.122591
		Boron and its compounds	Boron oxide	1303-86-2	0.043540	10.000000	0.030648
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.217700	50.000000	0.153239
			Subtotal		0.435400	100.0000000	0.306478
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.010000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.033597	99.990000	0.023649
			Subtotal		0.033600	100.0000000	0.023651
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001260	1.000000	0.000887
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.011340	9.000000	0.007982
		Silver and its compounds	Silver, metal	7440-22-4	0.113400	90.000000	0.079822
			Subtotal		0.126000	100.0000000	0.088691
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.001120	5.000000	0.000788
		Boron and its compounds	Boron oxide	1303-86-2	0.003360	15.000000	0.002365
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.001120	5.000000	0.000788
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.015680	70.000000	0.011037
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.001120	5.000000	0.000788
			Subtotal		0.022400	100.0000000	0.015767
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.043396	99.990000	0.030546
			Subtotal		0.043400	100.0000000	0.030549

Inductor 4	Ceramic 1	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000398	5.000000	0.000280
		Boron and its compounds	Boron oxide	1303-86-2	0.001194	15.000000	0.000841
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000398	5.000000	0.000280
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005574	70.000000	0.003923
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000398	5.000000	0.000280
			Subtotal		0.007963	100.0000000	0.005605
	Ceramic 2	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.047719	40.000000	0.033589
		Boron and its compounds	Boron oxide	1303-86-2	0.011930	10.000000	0.008397
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.059649	50.000000	0.041987
			Subtotal		0.119298	100.0000000	0.083973
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.023868	99.990000	0.016800
			Subtotal		0.023870	100.0000000	0.016802
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003184	99.990000	0.002242
			Subtotal		0.003185	100.0000000	0.002242
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.015906	99.990000	0.011196
			Subtotal		0.015908	100.0000000	0.011197
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.004777	99.990000	0.003363
			Subtotal		0.004777	100.0000000	0.003363

Resistor 1	Bottom Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000516	13.800000	0.000363
		Boron and its compounds	Boron oxide	1303-86-2	0.000045	1.200000	0.000032
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000172	4.600000	0.000121
		Silver and its compounds	Silver, metal	7440-22-4	0.003005	80.400000	0.002115
			Subtotal		0.003737	100.0000000	0.002631
	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.119641	96.100000	0.084216
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000498	0.400000	0.000351
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001868	1.500000	0.001314
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.002490	2.000000	0.001753
			Subtotal		0.124497	100.0000000	0.087633
	Conductor	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000246
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000458
			Subtotal		0.001000	100.0000000	0.000704
	Insulation 1	Chromium and Chromium III compounds	C.I. Pigment Black 28	68186-91-4	0.000208	5.000000	0.000146
		Epoxy Resins	Epikote 862	28064-14-4	0.003079	74.100000	0.002167
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000690	16.600000	0.000485
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000179	4.300000	0.000126
			Subtotal		0.004154	100.0000000	0.002924
	Insulation 2	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000140	6.700000	0.000098
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.001574	75.500000	0.001108
		Boron and its compounds	Boron oxide	1303-86-2	0.000021	1.000000	0.000015
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000350	16.800000	0.000247
			Subtotal		0.002085	100.0000000	0.001468
	Termination	Nickel and its compounds	Nickel, metal	7440-02-0	0.008309	40.000000	0.005849
		Tin and its compounds	Tin, metal	7440-31-5	0.012463	60.000000	0.008773
			Subtotal		0.020772	100.0000000	0.014621
	Top Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000187	4.500000	0.000132
		Boron and its compounds	Boron oxide	1303-86-2	0.000008	0.200000	0.000006
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000112	2.700000	0.000079
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000154	3.700000	0.000108
		Silver and its compounds	Silver, metal	7440-22-4	0.003693	88.900000	0.002600
			Subtotal		0.004154	100.0000000	0.002924

Resistor 2	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.403617	96.100000	0.284105
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.001680	0.400000	0.001182
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006300	1.500000	0.004435
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.008400	2.000000	0.005913
			Subtotal		0.419996	100.0000000	0.295635
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.001656	13.799000	0.001166
		Boron and its compounds	Boron oxide	1303-86-2	0.000144	1.200000	0.000101
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000553	4.608000	0.000389
		Silver and its compounds	Silver, metal	7440-22-4	0.009648	80.393000	0.006791
			Subtotal		0.012001	100.0000000	0.008448
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000720	4.500000	0.000507
		Boron and its compounds	Boron oxide	1303-86-2	0.000032	0.200000	0.000023
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000432	2.700000	0.000304
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000592	3.700000	0.000417
		Silver and its compounds	Silver, metal	7440-22-4	0.014224	88.900000	0.010012
			Subtotal		0.015999	100.0000000	0.011262
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.002656	16.600000	0.001870
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000688	4.300000	0.000484
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.004000	25.000000	0.002815
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.008656	54.100000	0.006093
			Subtotal		0.015999	100.0000000	0.011262
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.024000	99.990000	0.016893
			Subtotal		0.024002	100.0000000	0.016895
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000536	6.698000	0.000377
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.006040	75.476000	0.004252
		Boron and its compounds	Boron oxide	1303-86-2	0.000082	1.031000	0.000058
		Inorganic Silicon compounds	Quartz	14808-60-7	0.001344	16.795000	0.000946
			Subtotal		0.008002	100.0000000	0.005633
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.001100	5.501000	0.000774
		Boron and its compounds	Boron oxide	1303-86-2	0.000180	0.900000	0.000127
		Copper and its compounds	Cupric oxide	1317-38-0	0.000180	0.900000	0.000127
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.003940	19.702000	0.002773
		Lead and its compounds	Lead monooxide	1317-36-8	0.001128	5.641000	0.000794
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000360	1.800000	0.000253
		Palladium and its compounds	Palladium, metal	7440-05-3	0.001800	9.001000	0.001267
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.001800	9.001000	0.001267
		Silver and its compounds	Silver, metal	7440-22-4	0.008590	42.954000	0.006046
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000560	2.800000	0.000394
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000360	1.800000	0.000253
			Subtotal		0.019998	100.0000000	0.014077
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000700	34.965000	0.000493
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001302	65.035000	0.000916
			Subtotal		0.002002	100.0000000	0.001409
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.031996	99.990000	0.022522
			Subtotal		0.031999	100.0000000	0.022524

Semiconductor Die 1	Semiconductor Die	Arsenic and its compounds	Gallium arsenide	1303-00-0	0.294000	98.000000	0.206946
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.006000	2.000000	0.004223
			Subtotal		0.300000	100.0000000	0.211170

Semiconductor Die 2	Semiconductor Die	Arsenic and its compounds	Gallium arsenide	1303-00-0	0.294000	98.000000	0.206946
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.006000	2.000000	0.004223
			Subtotal		0.300000	100.0000000	0.211170

Semiconductor Die 3	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	0.337882	89.600000	0.237835
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.003394	0.900000	0.002389
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001886	0.500000	0.001327
		Silver and its compounds	Silver, metal	7440-22-4	0.001188	0.315000	0.000836
		Tin and its compounds	Tin, metal	7440-31-5	0.032751	8.685000	0.023054
			Subtotal		0.377100	100.0000000	0.265440

Solder Flux	Solder Flux	Aliphatic Amines	Other aliphatic amines		0.031245	41.660000	0.021993
		Aromatic hydrocarbon compounds	Polyethylene glycol	25322-68-3	0.025005	33.340000	0.017601
		Organic compounds	Other organic compounds.		0.018750	25.000000	0.013198
			Subtotal		0.075000	100.0000000	0.052792

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.003365	0.500000	0.002369
		Silver and its compounds	Silver, metal	7440-22-4	0.020190	3.000000	0.014212
		Tin and its compounds	Tin, metal	7440-31-5	0.649445	96.500000	0.457144
			Subtotal		0.673000	100.0000000	0.473724

Substrate, Pre-plated NiPdAu	Substrate, Pre-plated NiPdAu	Barium and its compounds	Barium sulfate	7727-43-7	0.926770	2.387500	0.652353
		Copper and its compounds	Copper, metal	7440-50-8	18.892099	48.668900	13.298134
		Epoxy Resins	Other Epoxy resins		0.245871	0.633400	0.173068
		Gold and its compounds	Gold, metal	7440-57-5	0.027755	0.071500	0.019536
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	5.740386	14.788100	4.040653
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	7.342388	18.915100	5.168301
		Magnesium and its compounds	Talc	14807-96-6	0.132407	0.341100	0.093201
		Nickel and its compounds	Nickel, metal	7440-02-0	0.767929	1.978300	0.540544
		Palladium and its compounds	Palladium, metal	7440-05-3	0.017274	0.044500	0.012159
		Phosphorus compounds	Proprietary Material-Other inorganic phosphorous compounds		0.132407	0.341100	0.093201
		Polymers	Plastic: PI - Polyimide		4.592316	11.830500	3.232528
			Subtotal		38.817600	100.0000000	27.323679

			Total		142.065789	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFRX5G272T4 Product content declaration of AFRX5G272T4		上次修订 Last Revision (GMT): Tuesday, 23 April 2024, 10:49:00 PM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic 1	O	O	O	O	O	O
	陶瓷的 Ceramic 2	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	陶瓷的 Ceramic 1	O	O	O	O	O	O
	陶瓷的 Ceramic 2	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 1	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	绝缘 Insulation 1	O	O	O	O	O	O
	绝缘 Insulation 2	O	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	顶部电导体 Top Conductor	X	O	O	O	O	O
电阻 Resistor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	X	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O
助焊剂 Solder Flux	助焊剂 Solder Flux	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFRX5G272T4		Last Revision (GMT): Tuesday, 23 April 2024, 10:49:00 PM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 5 Jun 2023	Test Report 5 Jun 2023	Test Report 5 Jun 2023	Test Report 5 Jun 2023
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 21 Oct 2023	Test Report 21 Oct 2023	Test Report 21 Oct 2023	Not Available
Inductor 1	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE BB	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE BC	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021
Inductor 2	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE BB	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE BC	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021
Inductor 3	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE BB	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE BC	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021
Inductor 4	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Resistor 1	ALUMINA	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	BOTTOM CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 1ST OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 2ND OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	NI PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TERMINAL CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TOP CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
Resistor 2	ALUMINA	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 15 Nov 2018	Test Report 15 Nov 2018	Test Report 15 Nov 2018	Test Report 15 Nov 2018
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Semiconductor Die 1		Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023
Semiconductor Die 2		Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023
Semiconductor Die 3		Test Report 23 Jun 2021	Test Report 23 Jun 2021	Test Report 23 Jun 2021	Test Report 23 Jun 2021
Solder Flux		Test Report 9 May 2023	Test Report 9 May 2023	Test Report 9 May 2023	Test Report 9 May 2023
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate, Pre-plated NiPdAu		Not Available	Not Available	Not Available	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
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Disclaimer