A3M34SL039IAAT2
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NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.
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| NXP Semiconductors | ||
| Product content declaration of A3M34SL039IAAT2 | Last Revision (GMT): Thursday, 27 November 2025, 03:08:00 AM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| A3M34SL039IAAT2 | SOT2059 | HLFLGA38 | 51.165910 mg | Yes | No | Yes | Not Applicable | Other | Not Applicable | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9354 348 51528 | 2025-12-12 | D | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 260 | 40 sec. | 3 | Kuala Lumpur, Malaysia;External manufacturing |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Capacitor 1 | Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000180 | 0.100000 | 0.000352 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.179820 | 99.900000 | 0.351445 | ||
| Subtotal | 0.180000 | 100.0000000 | 0.351797 | ||||
| Capacitor 2 | Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000090 | 0.100000 | 0.000176 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.089910 | 99.900000 | 0.175723 | ||
| Subtotal | 0.090000 | 100.0000000 | 0.175898 | ||||
| Capacitor 3 | Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000090 | 0.100000 | 0.000176 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.089910 | 99.900000 | 0.175723 | ||
| Subtotal | 0.090000 | 100.0000000 | 0.175898 | ||||
| Capacitor 4 | Nickel Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000033 | 0.010000 | 0.000064 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.329967 | 99.990000 | 0.644896 | ||
| Subtotal | 0.330000 | 100.0000000 | 0.644961 | ||||
| Inductor 1 | Nickel Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000017 | 0.010000 | 0.000034 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.174983 | 99.990000 | 0.341990 | ||
| Subtotal | 0.175000 | 100.0000000 | 0.342025 | ||||
| Inductor 2 | Nickel Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000350 | 0.100000 | 0.000684 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.349650 | 99.900000 | 0.683365 | ||
| Subtotal | 0.350000 | 100.0000000 | 0.684049 | ||||
| Inductor 3 | Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000035 | 0.010000 | 0.000068 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.349965 | 99.990000 | 0.683981 | ||
| Subtotal | 0.350000 | 100.0000000 | 0.684049 | ||||
| Resistor 1 | Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000058 | 0.010000 | 0.000114 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.581862 | 99.990000 | 1.137206 | ||
| Subtotal | 0.581920 | 100.0000000 | 1.137320 | ||||
| Resistor 2 | Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000007 | 0.010000 | 0.000014 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.072693 | 99.990000 | 0.142073 | ||
| Subtotal | 0.072700 | 100.0000000 | 0.142087 | ||||
| Resistor 3 | Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000004 | 0.010000 | 0.000007 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.037286 | 99.990000 | 0.072873 | ||
| Subtotal | 0.037290 | 100.0000000 | 0.072881 | ||||
| Substrate | Gold Plating | Gold and its compounds | Gold, metal | 7440-57-5 | 48.904109 | 99.990000 | 95.579477 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.004891 | 0.010000 | 0.009559 | |||
| Subtotal | 48.909000 | 100.0000000 | 95.589036 | ||||
| Total | 51.165910 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 A3M34SL039IAAT2 Product content declaration of A3M34SL039IAAT2 | 上次修订 Last Revision (GMT): Thursday, 27 November 2025, 03:08:00 AM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | 邻苯二甲酸二正丁酯(DBP) | 邻苯二甲酸二异丁酯(DIBP) | 邻苯二甲酸丁基苄酯(BBP) | 邻苯二甲酸二（2-乙基）己酯(DEHP) | ||
| 电容器 Capacitor 1 | 镀镍层 Nickel Plating | O | O | O | O | O | O | O | O | O | O |
| 电容器 Capacitor 2 | 镀镍层 Nickel Plating | O | O | O | O | O | O | O | O | O | O |
| 电容器 Capacitor 3 | 镀镍层 Nickel Plating | O | O | O | O | O | O | O | O | O | O |
| 电容器 Capacitor 4 | 镀镍层 Nickel Plating | O | O | O | O | O | O | O | O | O | O |
| 电感 Inductor 1 | 镀镍层 Nickel Plating | O | O | O | O | O | O | O | O | O | O |
| 电感 Inductor 2 | 镀镍层 Nickel Plating | O | O | O | O | O | O | O | O | O | O |
| 电感 Inductor 3 | 镀镍层 Nickel Plating | O | O | O | O | O | O | O | O | O | O |
| 电阻 Resistor 1 | 镀镍层 Nickel Plating | O | O | O | O | O | O | O | O | O | O |
| 电阻 Resistor 2 | 镀镍层 Nickel Plating | O | O | O | O | O | O | O | O | O | O |
| 电阻 Resistor 3 | 镀镍层 Nickel Plating | O | O | O | O | O | O | O | O | O | O |
| 基板 Substrate | 镀金材料 Gold Plating | O | O | O | O | O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 | |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. | |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 | |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. | |
| 备注： 该半导体产品的环保使用期限（EFUP）为50年。 Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years. | .jpg) |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of A3M34SL039IAAT2 | Last Revision (GMT): Thursday, 27 November 2025, 03:08:00 AM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Bonding Wire - Au | Test Report 25 Jun 2025 | Test Report 25 Jun 2025 | Test Report 25 Jun 2025 | Test Report 25 Jun 2025 | |
| Capacitor 1 | CERAMIC | Test Report 27 Oct 2025 | Test Report 27 Oct 2025 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 2 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 3 | CERAMIC | Test Report 27 Oct 2025 | Test Report 27 Oct 2025 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 4 | CERAMIC | Test Report 27 Oct 2025 | Test Report 27 Oct 2025 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 5 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 6 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 7 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 8 | CERAMIC | Test Report 27 Oct 2025 | Test Report 27 Oct 2025 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 9 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 10 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 11 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 12 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 13 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Capacitor 14 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | Test Report 21 Aug 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Die Encapsulant | Test Report 16 Jan 2025 | Test Report 16 Jan 2025 | Test Report 16 Jan 2025 | Test Report 16 Jan 2025 | |
| Epoxy Adhesive | Test Report 11 Apr 2025 | Test Report 11 Apr 2025 | Test Report 11 Apr 2025 | Test Report 11 Apr 2025 | |
| Inductor 1 | ELECTRODE | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 |
| INNER GLAZE | Not Available | Not Available | Not Available | Not Available | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER GLAZE | Not Available | Not Available | Not Available | Not Available | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Inductor 2 | ELECTRODE | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 |
| INNER GLAZE | Test Report 6 Aug 2025 | Test Report 6 Aug 2025 | Test Report 6 Aug 2025 | Test Report 6 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER GLAZE | Test Report 18 Sep 2025 | Test Report 18 Sep 2025 | Test Report 18 Sep 2025 | Test Report 18 Sep 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Inductor 3 | ELECTRODE | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 |
| INNER GLAZE | Test Report 6 Aug 2025 | Test Report 6 Aug 2025 | Not Available | Not Available | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER GLAZE | Test Report 18 Sep 2025 | Test Report 18 Sep 2025 | Not Available | Not Available | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Inductor 4 | ELECTRODE | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 |
| INNER GLAZE | Test Report 6 Aug 2025 | Test Report 6 Aug 2025 | Test Report 6 Aug 2025 | Test Report 6 Aug 2025 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER GLAZE | Test Report 18 Sep 2025 | Test Report 18 Sep 2025 | Test Report 18 Sep 2025 | Test Report 18 Sep 2025 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Inductor 5 | ELECTRODE | Test Report 24 Apr 2025 | Test Report 24 Apr 2025 | Not Available | Not Available |
| INNER GLAZE | Test Report 6 Aug 2025 | Test Report 6 Aug 2025 | Not Available | Not Available | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER GLAZE | Test Report 18 Sep 2025 | Test Report 18 Sep 2025 | Not Available | Not Available | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Resistor 1 | CERAMIC | Not Available | Not Available | Test Report 13 Feb 2020 | Not Available |
| EXTERNAL ELECTRODE | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | |
| INTERNAL ELECTRODE | Test Report 27 Dec 2019 | Test Report 27 Dec 2019 | Test Report 27 Dec 2019 | Test Report 27 Dec 2019 | |
| NI PLATING | Not Available | Not Available | Test Report 1 Sep 2020 | Test Report 1 Sep 2020 | |
| OVERCOAT | Test Report 20 Feb 2024 | Test Report 20 Feb 2024 | Not Available | Not Available | |
| OVERGLAZE | Test Report 31 Jan 2024 | Test Report 31 Jan 2024 | Test Report 31 Jan 2024 | Test Report 31 Jan 2024 | |
| RESISTIVE ELECTRODE | Test Report 19 Mar 2024 | Test Report 19 Mar 2024 | Not Available | Not Available | |
| SECONDARY ELECTRODE | Test Report 30 Jun 2023 | Test Report 30 Jun 2023 | Test Report 30 Jun 2023 | Test Report 30 Jun 2023 | |
| SN PLATING | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | |
| SUSBTRATE | Test Report 13 Feb 2020 | Test Report 13 Feb 2020 | Not Available | Test Report 13 Feb 2020 | |
| Resistor 2 | CERAMIC | Not Available | Not Available | Test Report 13 Feb 2020 | Not Available |
| EXTERNAL ELECTRODE | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | |
| INTERNAL ELECTRODE | Test Report 27 Dec 2019 | Test Report 27 Dec 2019 | Test Report 27 Dec 2019 | Test Report 27 Dec 2019 | |
| NI PLATING | Not Available | Not Available | Test Report 1 Sep 2020 | Test Report 1 Sep 2020 | |
| OVERCOAT | Test Report 20 Feb 2024 | Test Report 20 Feb 2024 | Not Available | Not Available | |
| OVERGLAZE | Test Report 31 Jan 2024 | Test Report 31 Jan 2024 | Test Report 31 Jan 2024 | Test Report 31 Jan 2024 | |
| RESISTIVE ELECTRODE | Test Report 19 Mar 2024 | Test Report 19 Mar 2024 | Not Available | Not Available | |
| SECONDARY ELECTRODE | Test Report 30 Jun 2023 | Test Report 30 Jun 2023 | Test Report 30 Jun 2023 | Test Report 30 Jun 2023 | |
| SN PLATING | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | |
| SUSBTRATE | Test Report 13 Feb 2020 | Test Report 13 Feb 2020 | Not Available | Test Report 13 Feb 2020 | |
| Resistor 3 | CERAMIC | Test Report 13 Feb 2020 | Test Report 13 Feb 2020 | Test Report 13 Feb 2020 | Test Report 13 Feb 2020 |
| INTERNAL ELECTRODE | Test Report 27 Dec 2019Test Report 15 Sep 2020 | Test Report 27 Dec 2019Test Report 15 Sep 2020 | Test Report 27 Dec 2019Test Report 15 Sep 2020 | Test Report 27 Dec 2019 | |
| NI PLATING | Test Report 30 Jun 2023 | Test Report 30 Jun 2023 | Test Report 30 Jun 2023 | Test Report 30 Jun 2023 | |
| OVERCOAT | Test Report 20 Feb 2024 | Test Report 20 Feb 2024 | Not Available | Not Available | |
| OVERGLAZE | Test Report 12 Nov 2020 | Test Report 12 Nov 2020 | Test Report 12 Nov 2020 | Test Report 12 Nov 2020 | |
| RESISTIVE LAYER | Test Report 16 Nov 2020 | Test Report 16 Nov 2020 | Not Available | Not Available | |
| SN PLATING | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | Test Report 1 Jun 2020 | |
| Resistor 4 | CERAMIC SUSBTRATE | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 |
| INK | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | |
| INNER ELECTRODE 1 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | |
| INNER ELECTRODE 2 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | |
| NI TERMINATION | Test Report 10 Dec 2021 | Test Report 10 Dec 2021 | Test Report 10 Dec 2021 | Test Report 10 Dec 2021 | |
| OVERCOAT | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | |
| PRIMARY GLASS | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | |
| RESISTIVE LAYER | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | Test Report 2 Mar 2021 | |
| SN TERMINATION | Test Report 10 Dec 2021 | Test Report 10 Dec 2021 | Test Report 10 Dec 2021 | Test Report 10 Dec 2021 | |
| Semiconductor Die 1 | Test Report 7 Aug 2025 | Test Report 7 Aug 2025 | Test Report 7 Aug 2025 | Test Report 7 Aug 2025 | |
| Semiconductor Die 2 | Test Report 7 Aug 2025 | Test Report 7 Aug 2025 | Test Report 7 Aug 2025 | Test Report 7 Aug 2025 | |
| Semiconductor Die 3 | SILICON | Test Report 19 Aug 2021 | Test Report 19 Aug 2021 | Test Report 19 Aug 2021 | Test Report 19 Aug 2021 |
| Solder Paste | Test Report 24 Oct 2024 | Test Report 24 Oct 2024 | Test Report 24 Oct 2024 | Test Report 24 Oct 2024 | |
| Substrate | AU PLATING | Test Report 25 Nov 2022 | Test Report 25 Nov 2022 | Test Report 25 Nov 2022 | Test Report 25 Nov 2022 |
| AUS SR1 | Not Available | Not Available | Not Available | Not Available | |
| CU FOIL | Test Report 18 Nov 2025 | Test Report 18 Nov 2025 | Test Report 18 Nov 2025 | Test Report 18 Nov 2025 | |
| CU PLATING | Test Report 2 May 2022 | Test Report 2 May 2022 | Test Report 2 May 2022 | Test Report 2 May 2022 | |
| GHPL-970LF | Test Report 6 Nov 2025 | Test Report 6 Nov 2025 | Test Report 6 Nov 2025 | Not Available | |
| For more information: contact us | |||||
| Note(s): |
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| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
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| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |