SOT617-11: HVQFN32

概述

HVQFN32, plastic thermal enhanced very thin quad flat package; no leads; 32 terminals, 0.5 mm pitch, 5 mm x 5 mm x 0.85 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
 SOT617-11 HVQFN32 surface mount quad HVQFN 5 x 5 x 0.85 32 plastic
生产代码 Reference Codes Issue Date
SOT617 MO-220(JEDEC 2013-01-29
部分 描述 Quick access
LPC802M001JHI33 Low-Cost Microcontrollers (MCUs) based on Arm® Cortex®M0+ Cores View parametrics
LPC865M201JHI33 Low-Cost Microcontrollers (MCUs) based on Arm Cortex M0+ Cores with I3C and FlexTimer View parametrics
LPC844M201JHI33 Low-Cost Microcontrollers (MCUs) based on Arm® Cortex®M0+ Cores View parametrics
LPC845M301JHI33 Low-Cost Microcontrollers (MCUs) based on Arm® Cortex®M0+ Cores View parametrics
LPC804M101JHI33 Low-Cost Microcontrollers (MCUs) based on Arm® Cortex®M0+ Cores View parametrics