SOT2173-1: WLCSP37

概述

WLCSP37, wafer level chip-size package; 37 terminals; 0.35 mm pitch; 2.63 mm x 2.495 mm x 0.49 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
 SOT2173-1 WLCSP37 WLCSP 2.63 x 2.945 x 0.49 37 silicon
生产代码 Reference Codes Issue Date
98ASA02186D
部分 描述 Quick access
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