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产品信息
封装
封装搜索
OL-TDA19988BU: UC
OL-TDA19988BU: UC
概述
Bare die; 84 bond pads
Package Version
Package Name
贴装
端子位置
封装风格
尺寸
終止計數
材料
OL-TDA19988BU
UC
surface mount
upper
UC
2.856 x 2.856 x 0.738
84
other
生产代码
Reference Codes
Issue Date
UC84
---(EIAJ);---(JEDEC);---(IEC
2011-06-10