NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
S9S08SG4E2MSC
Package Description:
SOIC 8
Tracking Number:
K10949D359
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Copper Lead Frame
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
High Pb Sn/Ti/W Bumps
RoHS CoA
Lead Frame Plating
RoHS CoA
Questions or additional information on a RoHS CoA report, please enter a service request