| Subcomponent Description |
Homogeneous Material Identification |
RoHS CoA |
| Bonding Wire, PdCu |
|
RoHS CoA
|
| Die Encapsulant |
|
RoHS CoA
|
| Non-Conductive Epoxy/Adhesive |
|
RoHS CoA
|
| Organic Substrate, Halogen-free |
AUS308 |
RoHS CoA
|
|
HL832NXA |
RoHS CoA
|
| Silicon Semiconductor Die |
LEAD FREE BUMP |
RoHS CoA
|
|
FAB 14 |
RoHS CoA
|
| Solder Balls - Lead Free |
|
RoHS CoA
|