NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MCIMX6Q6AVT08AER
Package Description:    FC-PBGA 624 21*21*2 P0.8
Tracking Number:   K50008S271


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Agent    RoHS CoA
Gel Die Encapsulant    RoHS CoA
Heat Spreader    RoHS CoA
Organic Substrate, Halogen-free  E679FGR  RoHS CoA
Silicon Semiconductor Die  LEAD FREE BUMP  RoHS CoA
  FAB 14  RoHS CoA
Solder Balls - Lead Free    RoHS CoA
Underfill    RoHS CoA


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