NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MC33CD1020AES
Package Description:
EXPOSED PAD 4.7*4.7MM
Tracking Number:
K10949D404
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Other
RoHS CoA
Copper Lead Frame
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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