NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
FS32V234CON1VUB
Package Description:
621 17*17*2.29 P0.65
Tracking Number:
K50008S380
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Agent
RoHS CoA
Die Encapsulant, Filler
RoHS CoA
Heat Spreader
RoHS CoA
Organic Substrate, Halogen-free
E700GR
RoHS CoA
COPPER
RoHS CoA
SR-7300G-B
RoHS CoA
GX-13
RoHS CoA
PHP-900 IR6
RoHS CoA
Pb-free Bumped Semiconductor Die
BUMP 6
RoHS CoA
TSMC 12
RoHS CoA
Solder Balls - Pb Free, Sn/Ag
RoHS CoA
Underfill
RoHS CoA
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