202104052F02 : SOT505-2 Assembly Transfer from ATP to ATBK

NXP has extensive manufacturing capabilities in the TSSOP8 family to which will be further expanded to include the part types in the attached file list. Mold compound and die adhesive materials in the ATBK manufacturing process will use the standard EMC-7470L-Q and QMI519 materials respectively. Additionally ATBK will employ a roughened leadframe as a package quality improvement to reduce delamination. From the change associated to the 'Packing/Shipping/Labeling' only the 'label' will change. It will reflect the appropriate ATBK assembly information that is standard on their labeling.

变化的原因

Due to an increasing demand for SOT505-2 packaged devices and ATP discontinuance of supply over time NXP is adding the ATBK flow to enable supply.

预期的影响

数据表的修订: No impact to existing datasheet

受影响的部分