202104052A : SOT505-2 Assembly Transfer from ATP to ATBK

NXP is expanding ATBK assembly capabilities to include the part types in the attached file list. Mold compound and die adhesive materials in the ATBK manufacturing process will use the standard EMC-7470L-Q and QMI519 materials respectively. Additionally ATBK will employ a roughened leadframe as a package quality improvement to reduce delamination. NXP has extensive manufacturing capabilities in the TSSOP8 family and with the critical demand for these products these changes will help with timely deliveries.

变化的原因

Due to an increasing demand for SOT505-2 packaged devices and ATP discontinuance of supply over time NXP is adding the ATBK flow as an alternate source to maintain timely deliveries.

预期的影响

数据表的修订: No impact to existing datasheet

受影响的部分