202012016F01 : MPC7448 and MPC7447A epoxy underfill raw material change to new supplier

NXP is pleased to announce the qualification of MPC7448 and MPC7447A epoxy underfill raw material from Resin A (supplier 1) to Resin B (supplier 2) to ensure supply continuity. Material property of Resin B is equivalent to Resin A. Hence the epoxy performance of Resin B is comparable to Resin A.

变化的原因

Resin A (supplier 1) was discontinued by the vendor. Resin B (supplier 2) was selected as the replacement and has comparable material properties to Resin A. There is no change to the underfill manufacturing process besides this material change.

预期的影响

数据表的修订: No impact to existing datasheet

受影响的部分