202005002I : OM1230 Internal Plating Thickness Change on Package Flange/Heatsink
NXP announces an internal plating thickness change for products in the OM1230 package outline.This plating thickness change reduces the amount of Au plating internal to the package from 75u" to 60u" which optimizes the product manufacturability/consistency.
| PCN类型 | 更改类别 | 发行日期 | 生效日期 |
|---|---|---|---|
| Customer Information Notification | Assembly materials | 09-May-2020 | 10-May-2020 |
变化的原因
Optimization of internal flange plating thickness for improved manufacturing consistency.
受影响产品的识别
Product identification does not change
预期的影响
数据表的修订: No impact to existing datasheet
No impact on form fit function reliability or quality.
受影响的部分
| 零件号/ 12NC | 上次购买日期 | 上次交货日期 | 备件 |
|---|---|---|---|
|
A2T09D400-23NR6 (935318726528) |
- | - | - |
|
A2T14H450-23NR6 (935316214528) |
- | - | - |
|
A2V07H525-04NR6 (935339924528) |
- | - | - |
|
A2V09H525-04NR6 (935330045528) |
- | - | - |