201909001A : XSON6 (SOT886) Assembly/Test Transfer from ATGD and ATSN to ATBK
NXP Semiconductors is transferring assembly and test of the SOT886 (XSON6) package from ATSN and ATGD to ATBK. Standard ATBK BOM and flows will be used.Product data sheets will be updated with new orderable part numbers to reflect the use of Static Shielding Bags (SSB). Orderable Part #s/12NC will be included in update of Final PCN.
| PCN类型 | 更改类别 | 发行日期 |
|---|---|---|
| Advanced Product Change Notification | Assembly location, Assembly materials, Assembly process, Packing/Shipping/Labeling, Test equipment, Test location | 16-Sep-2019 |
变化的原因
Move production to an NXP facility to assure product quality and delivery.
受影响产品的识别
Packing Labels will show Product Manufacturing Code (PMC) "n" to reflect ATBK assembly.
预期的影响
数据表的修订: A new datasheet will be issued
No impact on form fit function reliability or quality.
时间和内容
The Final PCN is planned to be issued on 20-Sep-2019
受影响的部分
| 零件号/ 12NC | 上次购买日期 | 上次交货日期 | 备件 |
|---|---|---|---|
|
NCX2200GM,115 (935294048115) |
- | - | - |
|
NX3L1G3157GM,115 (935284122115) |
- | - | - |
|
NX3L1G384GM,115 (935285982115) |
- | - | - |
|
NX3L1T3157GM,115 (935285418115) |
- | - | - |
|
NX3L1T5157GM,115 (935287633115) |
- | - | - |