201710007F01 : Bumping transfer from Chipbond to ASEK TFA9895UK/N2 and TFA9895BUK/N1
TFA9895UK/N2 and TFA9895BUK/N1 will be released in ASEK (back-end) flow due to closing of Chipbond facility. Changes will also be reflected in the product marking.
| PCN类型 | 更改类别 | 发行日期 | 生效日期 |
|---|---|---|---|
| Final Product Change Notification | Assembly location, Product marking, Test location | 11-Oct-2017 | 08-Jan-2018 |
变化的原因
Chipbond back-end facility closing per July 2017. Therefore back-end processes as well as industrial testing process is transferred to ASEK.
受影响产品的识别
Top side marking
预期的影响
数据表的修订: No impact to existing datasheet
No impact on form fit function reliability or quality.
受影响的部分
| 零件号/ 12NC | 上次购买日期 | 上次交货日期 | 备件 |
|---|---|---|---|
|
TFA9895UK/N2BZ (935303421079) |
- | - | - |