201710001F01 : LPC31xxFET180 LPC32xxFET296 Cu Wire Qualification for NXP-ATKH

Copper wire has been qualified and will be added as a wirebond material. To support a robust wirebond process the mold compound has also changed. Upon expiration of this notice NXP will begin shipping product with copper wire.See attached Self Qualification Report (SQR) for details of the affected part numbers material changes and qualification test results.

变化的原因

Adding Copper wire is required to mitigate against raw material cost increases and for supply assurance.The die attach material and mold compound change enable a robust Cu wirebond process.

受影响产品的识别

Top side marking Product revision is incremented. See marking details in attached SQR document.

预期的影响

数据表的修订: No impact to existing datasheet

Wire composition lead frame finish and mold compound are the only change to form. No Impact to fit or function. Reliability is equivalent or improved.

受影响的部分