201702020F01 : S912ZVML&MCxxF3xxx Qualification

NXP Semiconductors is announcing qualification of new part number S912ZVML&MCxxF3xxx with mask set revision 3N95G.Compared to S912ZVML&MCxxF1/F2xxx the S912ZVML&MCxxF3xxx's (3N95G) lead frame exposed pad size was changed from 4.9x4.9mm to 6.1x6.1mm flag size was changed from 5.5x5.5mm to 6.82x6.82mm mold compound was standardized from Hitachi CEL9200HF10M-CW to Hitachi CEL9240HF16FL and die thickness was changed from 330um to 280um. The CofDC has been updated to reflect a change to the mold compound lead Frame and die thickness. Please see attached CofDC.The errata document S12ZVM128_3N95G 17 March 2016 for S912ZVML&MCxxF3xxx is released. Errata ID E8188 was removed. The updated errata documentation is attached to this notice and can be found at:http://www.nxp.com/products/automotive-products/microcontrollers-and-processors/16-bit-s12-magniv/s12zvm-mixed-signal-mcu-for-automotive-industrial-motor-control-applications:S12ZVM?tab=Documentation_Tab

变化的原因

Fixed errata on 1N95G and 2N95G.Combined 1N95G & 2N95G functionality on 3N95G.The lead frame exposed pad size and flag size mold compound and die thickness changes are for standardization and to enable a more robust packaging.

受影响产品的识别

Replacement part type created see Parts Affected list

预期的影响

数据表的修订: No impact to existing datasheet

There are potential hardware and/or software implications to customers lead frame exposed pad size was changed from 4.9x4.9mm to 6.1x6.1mm Please contact local Sales or FAE.

受影响的部分