SOT932-1: TFBGA176

概述

plastic thin fine-pitch ball grid array package; 176 balls; body 6 x 15 x 0.7 mm

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT932-1	TFBGA176	surface mount	bottom	TFBGA		176	plastic

生产代码	Reference Codes	Issue Date
SOT932	MO-246(JEDEC	2006-01-16

产品

部分	描述	Quick access
SSTUB32868ET	1.8 V 28-bit 1 : 2 configurable registered buffer with parity for DDR2-800 RDIMM applications	View parametrics
SSTUM32868ET	1.8 V 28-bit 1 : 2 configurable registered buffer with parity for DDR2-800 RDIMM applications	View parametrics