SOT855-6: HTQFP64

概述

HTQFP64, thermal enhanced thin quad flat package; 64 terminals, 0.5 mm pitch, 10 mm x 10 mm x 1 mm body; exposed die pad

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT855-6	HTQFP64	surface mount		HTQFP	10 x 10 x 1	64	plastic

生产代码	Reference Codes	Issue Date
98ASA01609D		2021-12-14

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