SOT727-1: HLBGA475

概述

plastic thermal enhanced low profile ball grid array package; 475 balls; body 35 x 35 x 0.9 mm; heatsink

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT727-1	HLBGA475	surface mount	bottom	HLBGA		475	plastic

生产代码	Reference Codes	Issue Date
SOT727	MO-192(JEDEC	2002-02-07