SOT687-1: HVQFN68; MLF


概述

plastic, thermal enhanced very thin quad flat package; 68 terminals; 0.5 mm pitch; 10 mm x 10 mm x 0.85 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
HVQFN68; MLF surface mount quad HVQFN 10 x 10 x 0.85 68 plastic
生产代码 Reference Codes Issue Date
SOT687 MO-220(JEDEC 2003-06-13