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产品信息
封装
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SOT633-3: HTSSOP38
SOT633-3: HTSSOP38
概述
plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
Package Version
Package Name
贴装
端子位置
封装风格
尺寸
終止計數
材料
SOT633-3
HTSSOP38
surface mount
double
HTSSOP
38
plastic
生产代码
Reference Codes
Issue Date
SOT633
2004-01-22