SOT617-13: HVQFN


概述

plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm
Package Version Package Name 贴装 端子位置 封装风格 尺寸 焊端数 材料
HVQFN surface mount quad HVQFN 5 x 5 x 0.85 32 plastic
生产代码 Reference Codes Issue Date
SOT617 2015-01-12
部分 说明 Quick access
Ultra low power Bluetooth LE system-on-chip solution