SOT612-3: HLQFP144


概述

plastic thermal enhanced low profile quad flat package; 144 leads; body 20 mm x 20 mm x 1.4 mm; exposed die pad
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
HLQFP144 surface mount quad HLQFP 20 x 20 x 1.4 144 plastic
生产代码 Reference Codes Issue Date
SOT612 MS-026(JEDEC 2004-07-05
部分 描述 Quick access
Dual modem AISG Transceiver with embedded ARM Cortex M3 Processor
Single modem AISG Transceiver with embedded ARM Cortex M3 processor