SOT549-3: HTSSOP32

概述

plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT549-3	HTSSOP32	surface mount	double	HTSSOP		32	plastic

生产代码	Reference Codes	Issue Date
SOT549	MO-153(JEDEC	2005-11-02