SOT536-1: LFBGA96


概述

plastic, low profile fine-pitch ball grid array package; 96 balls; 0.8 mm pitch; 13.5 mm x 5.5 mm x 1.5 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
LFBGA96 surface mount bottom LFBGA 13.5 x 5.5 x 1.5 96 plastic
生产代码 Reference Codes Issue Date
SOT536 2003-02-05
部分 描述 Quick access
1.8 V configurable registered buffer for DDR2-800 RDIMM applications
1.8 V configurable registered buffer for DDR2 RDIMM applications
1.8 V 25-bit 1:1 or 14-bit 1:2 configurable registered buffer with parity for DDR2 RDIMM applications
1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-800 RDIMM applications
1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-667 RDIMM applications
1.8 V high output drive configurable registered buffer for DDR2 RDIMM applications