SOT2295-1: H-FC-PBGA625

概述

H-FC-PBGA625, thermal enhanced - flip chip - plastic ball grid array, 625 terminals, 0.65 mm pitch, 17 mm x 17 mm x 1.446 mm body

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT2295-1	H-FC-PBGA625	surface mount	bottom	H-FC-PBGA	17 x 17 x 1.446	625	plastic

生产代码	Reference Codes	Issue Date
98ASA02278D		2025-07-22

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