| Package Version | Package Name | 贴装 | 端子位置 | 封装风格 | 尺寸 | 終止計數 | 材料 |
|---|---|---|---|---|---|---|---|
| SOT2283-1 | FC-PQFN-COL24 | surface mount | quad | FC-PQFN-COL | 4.5 x 3.5 x 0.75 | 24 | plastic |
| 生产代码 | Reference Codes | Issue Date |
|---|---|---|
| 98ASA02280D |
| 部分 | 描述 | Quick access |
|---|---|---|
| MPF5302BVNAAEP | Thermal enhanced - flip chip - plastic, quad flat non-lead, 24 terminals, 0.5 mm pitch, 3.5 mm x 4.5 mm x 0.75 mm body | View parametrics |
| MPF5302BVNA0EP | Thermal enhanced - flip chip - plastic, quad flat non-lead, 24 terminals, 0.5 mm pitch, 3.5 mm x 4.5 mm x 0.75 mm body | View parametrics |
| MPF5300BVNA0EP | Thermal enhanced - flip chip - plastic, quad flat non-lead, 24 terminals, 0.5 mm pitch, 3.5 mm x 4.5 mm x 0.75 mm body | View parametrics |
| MPF5301BVNA0EP | Thermal enhanced - flip chip - plastic, quad flat non-lead, 24 terminals, 0.5 mm pitch, 3.5 mm x 4.5 mm x 0.75 mm body | View parametrics |
| MPF5301BVNABEP | Thermal enhanced - flip chip - plastic, quad flat non-lead, 24 terminals, 0.5 mm pitch, 3.5 mm x 4.5 mm x 0.75 mm body | View parametrics |
| MPF5300BVNBREP | Thermal enhanced - flip chip - plastic, quad flat non-lead, 24 terminals, 0.5 mm pitch, 3.5 mm x 4.5 mm x 0.75 mm body | View parametrics |