SOT2235-1: WLCSP114

概述

WLCSP114, wafer level chip scale package, 114 terminals, 0.33 mm pitch, 4.495 mm x 4.0 mm x 0.455 mm body (backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT2235-1	WLCSP114	surface mount	upper	WLCSP	4.495 x 4 x 0.455	114	silicon

生产代码	Reference Codes	Issue Date
98ASA02158D		2024-12-02