SOT2198-1: H-FC-PBGA798

概述

H-FC-PBGA798, thermal enhanced - flip chip - plastic ball grid array, 798 terminals, 0.65 mm pitch, 19 mm x 19 mm x 1.94 mm body

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT2198-1	H-FC-PBGA798	surface mount	bottom	H-FC-PBGA	19 x 19 x 1.94	798	plastic

生产代码	Reference Codes	Issue Date
98ASA01985D		2024-06-07

产品

部分	描述	Quick access
S32N530AACN0VUDT	S32N53, Vehicle Super-Integration Processor, Arm® Cortex®-R52, HSE2, Std Sec FW, NETC3, CSR, CAN FD/XL, GbE, 798 FCBGA	View parametrics
S32N550AACN0VUDT	S32N55, Vehicle Super-Integration Processor, Arm® Cortex®-R52, HSE2, Std Sec FW, NETC3, CSR, CAN FD/XL, GbE, 798 FCBGA	View parametrics
S32N550APCN0VUDT	S32N55, Vehicle Super-Integration Processor, Arm® Cortex®-R52, HSE2, Prem Sec FW, NETC3, CSR, CAN FD/XL, GbE, 798 FCBGA	View parametrics
S32N530APCN0VUDT	S32N53, Vehicle Super-Integration Processor, Arm® Cortex®-R52, HSE2, Prem Sec FW, NETC3, CSR, CAN FD/XL, GbE, 798 FCBGA	View parametrics